Graphene Conductive Layer for High-Resolution Electron Beam Lithography

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Solution Overview

Problem

Existing methods for creating nanostructures via electron beam lithography on insulated substrates face challenges due to low electric conductivity and electron scattering by metal atoms, limiting resolution and accuracy.

Innovation Solution

A method involving the application of a graphene film as a conductive layer on the substrate, followed by electron beam lithography to pattern openings, and subsequent removal of the conductive layer, allowing for the formation of nanostructures with high resolution by preventing electron accumulation and scattering.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If an additive metal layer (such as Cr) is used to improve the electric conductivity of the substrate, then the electric conductivity is improved, but electrons are scattered by the metal atoms causing a boundary effect that reduces manufacturing precision

Engineering Contradiction:
Improveelectric conductivityVSAvoidnanostructure resolution
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent changes the material parameter of the conductive layer from traditional heavy metal (Cr) to graphene. Graphene has superior electrical conductivity and, crucially, its carbon atoms have much smaller atomic mass compared to metal atoms. This parameter change eliminates electron scattering and boundary effects while maintaining high conductivity, thereby resolving the contradiction between improving conductivity and maintaining manufacturing precision.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If a conductive layer is added to improve substrate conductivity, then electric conductivity is improved, but the process complexity increases

Engineering Contradiction:
Improveelectric conductivityVSAvoidprocess steps
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The graphene layer serves multiple functions simultaneously: it provides the necessary electrical conductivity for electron beam lithography, acts as a protective layer during processing, and enables high-resolution patterning. This multi-functionality reduces the need for additional separate layers or processes, thereby simplifying the overall device structure despite the advanced material used.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the resolution of nanostructures to less than 100 nanometers, simplifies the process, and maintains the integrity of the graphene film, enabling its use on both rigid and flexible substrates with improved conductivity.

Implementation Method 1

a part of the resist layer is exposed by an electron beam etching

Methodology Applied
Scientific EffectElectron beam etching: Electron Beam

Implementation Method 2

the conductive layer comprises a graphene film... preventing electron accumulation

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 3

forming a plurality of openings 11 by patterning the resist layer 130 via electron beam lithography

Methodology Applied
Scientific EffectElectron beam lithography: Electron Beam

Data Source

PatentUS9213241B2Method of making nanostructure
Publication Date: 2015.12.15 HON HAI PRECISION INDUSTRY CO LTD
  • US9213241B2 patent drawing
  • US9213241B2 patent drawing
  • US9213241B2 patent drawing

AI summary

A method for making nanostructure is provided. The method includes following steps. A conductive layer including a graphene film is applied on an insulating substrate. A resist layer is placed on the conductive layer. A number of openings are formed by patterning the resist layer via electron beam lithography. A part of the conductive layer is exposed to form a first exposed portion through the plurality of openings. The first exposed portion of the conductive layer is removed to expose a part of the insulting substrate to form a second exposed portion. A preform layer is introduced on the second exposed portion of the insulating substrate. Remaining resist layer and remaining conductive layer are eliminated. A number of nanostructures are formed.