Graphene-Copper Laminate Interconnects for High Current Density
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional materials struggle to form satisfactory electrical interconnects with high current density in densely packed integrated circuitry, making it difficult to achieve efficient electrical connections.
Innovation Solution
The use of graphene sandwiched between metallic materials, such as copper and nickel, within a laminate structure, which enhances electron mobility and supports ultra-high current densities by forming a laminate structure with alternating graphene and non-graphene regions, and forming electrical contacts to facilitate current transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional materials (conductive semiconductor, metals, metal-containing compositions) are used for electrical interconnects, then the interconnects can be formed with existing processing techniques, but they cannot sustain high current density within relatively small physical dimensions
Solution Approach 1:
The patent employs a composite laminate structure consisting of alternating conductive and insulating layers, where the conductive layers contain graphene embedded in a metallic matrix (such as copper). This composite architecture enables the interconnect to sustain ultra-high current densities while maintaining compact physical dimensions, as graphene provides superior electron transport properties while the metallic matrix provides structural support and additional conductivity pathways.
2Productivity
If integrated circuit density is increased, then more circuit devices can be packed into smaller areas, but it becomes increasingly difficult to form satisfactory electrical interconnects
Solution Approach 1:
The laminate composite structure with graphene-enhanced conductive layers provides the necessary performance for high-density interconnects, enabling both increased device density and maintained interconnect reliability through superior current carrying capacity in reduced cross-sections.
Solution Approach 2:
The patent changes the material composition parameter by incorporating graphene into the conductive layers, fundamentally altering the electrical and thermal properties of the interconnect structure to meet the demands of high-density integrated circuits.
3Reliability
If graphene is sandwiched between metallic materials in a laminate structure, then electron mobility and current density capability are enhanced, but the manufacturing process becomes more complex
Solution Approach 1:
The patent segments the interconnect structure into alternating conductive and insulating layers, with graphene specifically positioned within the conductive layers. This segmentation allows for systematic fabrication through sequential deposition processes and enables the complex functionality to be built from simpler, repeated structural units.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the formation of interconnects that can sustain significantly higher current densities than conventional materials, improving the efficiency of electrical connections in integrated circuits while maintaining low contact resistance.
Implementation Method 1
The graphene may be sandwiched between non-graphene materials. At least one of the non-graphene materials directly against the graphene may be a metallic material (such as a material comprising one or both of copper and nickel). A large surface area of the graphene is directly against the metallic material, which may enhance electron mobility between the metallic material and the graphene.
Data Source
AI summary
Some embodiments include electrical interconnects. The interconnects may contain laminate structures having a graphene region sandwiched between non-graphene regions. In some embodiments the graphene and non-graphene regions may be nested within one another. In some embodiments an electrically insulative material may be over an upper surface of the laminate structure, and an opening may extend through the insulative material to a portion of the laminate structure. Electrically conductive material may be within the opening and in electrical contact with at least one of the non-graphene regions of the laminate structure. Some embodiments include methods of forming electrical interconnects in which non-graphene material and graphene are alternately formed within a trench to form nested non-graphene and graphene regions.