Graphene-Doped Adhesive for Display Buffering
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Solution Overview
Problem
Existing buffer structures for display modules face challenges in balancing buffer performance and film printing performance, with silicon-based pressure-sensitive adhesive materials improving buffer performance but increasing the risk of poor film printing effects.
Innovation Solution
A buffer structure is developed that includes a silicon-based pressure-sensitive adhesive layer doped with graphene, which enhances thermal conductivity and mechanical strength, thereby improving both buffer performance and film printing effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If silicon-based pressure-sensitive adhesive material is used to improve buffer performance, then buffer performance is improved, but film printing performance deteriorates
Solution Approach 1:
The patent changes the physical and chemical parameters of the silicon-based pressure-sensitive adhesive material by doping it with graphene. This modification alters the material's thermal conductivity and mechanical properties, enabling it to maintain buffer performance while improving film printing quality. The graphene doping creates a composite material with optimized parameters that resolve the contradiction between buffer performance and film printing performance.
Solution Approach 2:
The patent creates a composite material by combining silicon-based pressure-sensitive adhesive with graphene. This composite structure leverages the buffering properties of the silicon-based material and the exceptional thermal and mechanical properties of graphene to achieve both good buffer performance and film printing performance. The composite material approach allows simultaneous optimization of previously conflicting properties.
2Length of stationary object
If display panel thickness is reduced, then device thinning is achieved, but buffer performance may deteriorate
Solution Approach 1:
The patent modifies the material parameters of the buffer layer by incorporating graphene, which enables the buffer to maintain effective performance at reduced thickness. The high thermal conductivity and mechanical strength provided by graphene allow the buffer to function effectively with thinner dimensions, resolving the contradiction between device thinning and buffer performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The graphene-doped silicon-based pressure-sensitive adhesive layer effectively improves the thermal conductivity and mechanical strength of the buffer structure, leading to enhanced buffer performance and improved film printing effects while maintaining a reduced thickness of the display panel.
Implementation Method 1
the graphene includes a first-type graphene and/or a second-type graphene... effectively improves the thermal conductivity of the buffer structure
Implementation Method 2
the silicon-based pressure-sensitive adhesive layer is doped with a graphene... enhances thermal conductivity and mechanical strength
Data Source
AI summary
The present application provides a buffer structure, a display module, and a display device. The buffer structure includes a silicon-based pressure-sensitive adhesive layer, and the silicon-based pressure-sensitive adhesive layer is doped with graphene. Doping the graphene in the silicon-based pressure-sensitive adhesive layer allows thermal conductivity of the buffer structure to be effectively improved, and allows mechanical strength of the buffer structure to be enhanced, thereby improving buffer performance of the buffer structure and improving a film printing effect.