Graphene Laminated Structure with Fluorine Plasma-Treated hBN Buffer

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Solution Overview

Problem

Existing methods for depositing high-k insulating materials on graphene surfaces often damage the graphene or result in non-uniform deposition, making it challenging to form high-quality insulating layers for electronic devices like top gate transistors.

Innovation Solution

A method involving plasma-treating a hexagonal boron nitride sheet with fluorine-based gas plasma, which is then deposited on a graphene sheet as a buffer layer, allowing for the formation of a high-k insulating layer without damaging the graphene surface, using techniques like atomic layer deposition.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If high-k material is directly deposited on graphene, then insulating layer formation is achieved, but graphene surface is damaged and deposition is non-uniform

Engineering Contradiction:
Improvedeposition uniformityVSAvoidgraphene surface damage
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

A buffer layer is introduced between the graphene and the high-k insulating material. This intermediary layer prevents direct contact between the graphene and the deposition process, eliminating surface damage while providing a suitable substrate for uniform high-k material deposition. The buffer layer acts as a mediator that protects the sensitive graphene while enabling the formation of the insulating layer.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The buffer layer is deposited on the graphene surface before the high-k insulating material is applied. This preliminary action prepares the surface by creating a protective interface that prevents subsequent damage during the insulating layer formation process, ensuring both graphene integrity and deposition uniformity.

Inventive Principle:
Principle #10Preliminary action

2Object-affected harmful factors

If buffer layer is introduced between graphene and insulating layer, then graphene surface is protected, but device structure complexity increases

Engineering Contradiction:
Improvegraphene surface damageVSAvoidlaminated structure
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The buffer layer is implemented as a thin film structure that provides protective functionality without adding significant bulk or complexity to the device. This thin film approach maintains the compactness of the overall device while delivering the necessary protection and interface properties for high-k material deposition.

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the formation of high-quality, high-k insulating layers on graphene without surface damage, improving the performance and reliability of electronic devices such as transistors by enhancing the interfacial adhesive force and facilitating uniform deposition.

Implementation Method 1

plasma-treating a surface of a hexagonal boron nitride sheet using fluorine-based gas plasma

Methodology Applied
Scientific EffectPlasma treatment: Plasma

Implementation Method 2

depositing the hexagonal boron nitride sheet on a graphene sheet

Methodology Applied
Scientific EffectPhysical vapor deposition: Physical Vapour Deposition

Data Source

PatentUS9058985B2Method of manufacturing graphene laminated structure, graphene laminated structure, and electronic device including the graphene laminated structure
Publication Date: 2015.06.16 SAMSUNG ELECTRONICS CO LTD
  • US9058985B2 patent drawing
  • US9058985B2 patent drawing
  • US9058985B2 patent drawing

AI summary

A method of manufacturing a graphene laminated structure includes plasma-treating a surface of a hexagonal boron nitride sheet using a fluorine-based gas plasma, depositing the hexagonal boron nitride sheet on a graphene sheet, and forming an insulating layer on a surface of the surface-treated hexagonal boron nitride sheet.