Graphene-Coated Heat Spreader for Processor Die Cooling
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Solution Overview
Problem
Current cooling solutions for computing devices, such as heat sinks and fans, are inefficient in dissipating heat generated by processor dies, leading to thermal management challenges that affect performance and reliability.
Innovation Solution
A graphene-coated heat spreader is thermally coupled to the processor die, utilizing a thermally conductive body with a graphene layer to enhance heat distribution and dissipation, either on the inner or outer surface of the heat spreader, thereby improving thermal conductivity and emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional heat sinks and fans are used for cooling, then the cooling system can be implemented, but the cooling efficiency is insufficient to effectively dissipate heat from processor dies
Solution Approach 1:
The patent applies graphene coating to the heat spreader surface, fundamentally changing the thermal emission parameters of the material. Graphene's superior thermal conductivity and radiative properties enable more efficient heat dissipation compared to conventional materials, directly addressing the insufficient cooling efficiency of traditional heat sinks and fans
Solution Approach 2:
The invention combines conventional heat spreader materials (such as copper or aluminum) with graphene coating to create a composite thermal management system. This composite structure leverages the high thermal conductivity of the base material for heat distribution and the superior radiative emission properties of graphene for enhanced heat dissipation, resolving the contradiction between cooling efficiency and thermal management performance
2Productivity
If processor dies operate at higher performance levels, then computing performance improves, but heat generation increases requiring more complex cooling systems
Solution Approach 1:
The patent converts the harmful effect of high heat generation from high-performance processor operation into a beneficial thermal management solution. By using graphene-coated heat spreaders, the excessive heat generated at high performance levels is efficiently captured and radiated away, allowing the system to sustain higher performance levels without proportional increases in cooling system complexity
Solution Approach 2:
The graphene coating changes the thermal radiation parameters of the heat spreader surface, enabling more effective heat dissipation at higher temperatures. This parameter change allows the system to maintain acceptable die temperatures even when processors operate at elevated performance levels that generate excessive heat
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The graphene-coated heat spreader effectively increases cooling efficiency, allowing processor dies to operate at higher performance levels while maintaining acceptable temperatures, reducing the need for complex cooling systems and enhancing thermal management.
Implementation Method 1
a graphene layer contacting a surface of the body... utilizing a thermally conductive body with a graphene layer to enhance heat distribution and dissipation
Implementation Method 2
improving thermal conductivity and emission... enhancing thermal management
Data Source
AI summary
An integrated circuit device assembly including a graphene-coated heat spreader, including: a substrate; a die coupled to the substrate; and a heat spreader thermally coupled to the die, the heat spreader comprising: a body of thermally conductive metal defining a cavity at least partially surrounding the die; and a graphene layer contacting a surface of the body.