Graphene Insulation Heat Dissipating Layer for Semiconductor Package Carrier Boards
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Solution Overview
Problem
The existing flip-chip package substrates suffer from inadequate heat dissipation due to solder resist layers with low heat conductivity, which affects the performance and lifespan of electronic package products, especially for high-power applications like AI chips and stacked chips.
Innovation Solution
A semiconductor package carrier board with a graphene-based insulation heat dissipating layer on its surface, featuring holes that expose solder pads, and optionally a conductive or non-conductive rigid layer with conductive elements in contact with the graphene layer for enhanced heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder resist layers made of ink or solder mask are used on the carrier board, then the insulation function is provided, but the heat dissipation performance deteriorates due to low heat conductivity (0.2 to 0.4 W/m·k)
Solution Approach 1:
The patent applies composite materials by combining graphene material with polymer material to create a solder resist layer that possesses both insulation properties and high heat dissipation capability. The graphene material provides excellent thermal conductivity while the polymer material maintains the insulation function, thus resolving the contradiction between insulation and heat dissipation performance.
Solution Approach 2:
The patent changes the physical and chemical parameters of the solder resist layer by incorporating graphene material, which fundamentally alters the thermal conductivity parameter from 0.2-0.4 W/m·k to a much higher value while maintaining the insulation properties through the polymer matrix.
2Device complexity
If heat is not dissipated quickly from the carrier board, then the structure remains simple, but the performance and lifespan of the electronic package product deteriorate
Solution Approach 1:
The patent changes the thermal conductivity parameter of the solder resist layer by incorporating graphene material, transforming it from a poor heat conductor to an efficient heat dissipation layer, thereby improving performance and lifespan without significantly increasing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The graphene layer significantly improves heat dissipation speed, enhancing the performance and lifespan of electronic packages by conducting heat away efficiently, making them suitable for high-power products with demanding heat dissipation requirements.
Implementation Method 1
the insulation heat dissipating layer being a graphene layer, disposed on a whole surface of the first side and/or a whole surface of the second side of the circuit structure... The graphene layer significantly improves heat dissipation speed, enhancing the performance and lifespan of electronic packages by conducting heat away efficiently
Data Source
AI summary
A semiconductor package carrier board, a method for fabricating the same, and an electronic package having the same are provided. The method includes forming on a circuit structure a graphene layer that acts as an insulation heat dissipating layer. Since the heat conductivity of the graphene layer is far greater than the heat conductivity of ink (about 0.4 W/m·k), which is used as solder resist, the heat of the semiconductor package carrier board can be conducted quickly, and thus can avoid the problem that the heat will be accumulated on the semiconductor package carrier board.