Graphene Laminate Binder Layer Transfer Method
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Solution Overview
Problem
Existing graphene laminates suffer from defects due to the transfer process, which affects their electrical characteristics and homogeneity, limiting their practical application in devices.
Innovation Solution
A graphene laminate is prepared by growing graphene on a graphitization catalyst film, applying a binder layer composed of curable resins on a substrate, and then transferring the graphene with the catalyst film to the substrate, followed by removing the catalyst film to minimize defects and enhance binding, using a method that includes curing the binder layer to secure the graphene to the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If graphene is transferred to a substrate using conventional methods, then the graphene can be applied to devices, but defects are introduced that degrade electrical characteristics and homogeneity
Solution Approach 1:
The patent introduces a binder layer as an intermediary substance between the substrate and graphene. This binder layer facilitates the transfer process while minimizing direct contact-induced defects. The binder layer composition and curing process are specifically designed to transfer graphene with fewer defects and better electrical characteristics compared to conventional direct transfer methods.
Solution Approach 2:
The patent applies the binder layer to the substrate before transferring the graphene. This preliminary action prepares the substrate surface in advance, creating an optimal interface for graphene transfer that reduces defects. The binder layer is applied and cured beforehand, establishing a controlled environment for the subsequent graphene transfer process.
2Strength
If a binder layer is applied to bind graphene to the substrate, then binding strength is improved, but the process complexity increases
Solution Approach 1:
The patent utilizes parameter changes in the binder layer through curing processes. The binder layer transitions from a liquid or soft state during application to a cured, strong-bonding state after treatment. This parameter change (from uncured to cured) enables strong binding without requiring complex multi-step processes, as the curing can be achieved through standard thermal or chemical treatment.
3Strength
If the binder layer thickness is increased to improve binding, then adhesion is enhanced, but transparency and electrical characteristics are degraded
Solution Approach 1:
The patent optimizes the binder layer thickness parameter to achieve the desired balance. By controlling the thickness within a specific range and using curing processes, the binder layer provides sufficient adhesion while maintaining transparency and electrical characteristics. The curing process further enhances binding strength without requiring increased thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The approach results in a large-sized graphene laminate with reduced defects, improved electrical characteristics, and enhanced homogeneity, suitable for use in various devices such as transparent electrodes and electrical devices.
Implementation Method 1
a binder layer on the substrate, and graphene on the binder layer, wherein the graphene is bound to the substrate by the binder layer
Implementation Method 2
The binder layer may be a cured resin layer formed from at least one of a room-temperature curable resin, a thermally curable resin, a hot-melt resin, or a low-pressure curable resin
Data Source
AI summary
A graphene laminate including a substrate, a binder layer on the substrate, and graphene on the binder layer, wherein the graphene is bound to the substrate by the binder layer.