Graphene Layer Thermal Management for Memory Modules
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Solution Overview
Problem
Conventional thermal management approaches for memory modules and packages are inefficient due to costly and space-consuming heat sinks that primarily focus on the backside of heat-generating components, limiting heat dissipation from the front side where most heat is generated.
Innovation Solution
Incorporating a thin graphene layer between heat-generating semiconductor devices and the substrate, allowing for efficient heat conduction from the front side, while maintaining electrical isolation and enabling the use of larger thermal structures by offsetting them laterally.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat sinks are used for thermal management, then heat dissipation is achieved, but the module occupies excessive space and airflow is restricted
Solution Approach 1:
The patent extracts the thermal management function from traditional bulky heat sinks and implements it through a thin graphene layer integrated directly into the substrate. This extraction reduces the volume occupied by thermal management components while maintaining effective heat dissipation from the front side of memory devices.
Solution Approach 2:
The patent employs a thin graphene film as the thermal management solution. This thin film approach replaces conventional thick heat sinks, significantly reducing the volume occupied by thermal management components while maintaining effective heat dissipation. The graphene layer is deposited on the substrate and provides thermal conduction without restricting airflow.
2Temperature
If heat sinks focus on the backside of memory devices, then thermal management is provided, but heat dissipation from the front side is limited
Solution Approach 1:
The patent inverts the conventional approach by providing thermal management on the front side of memory devices through the graphene layer integrated into the substrate, rather than only on the backside. This inversion enables direct heat dissipation from the heat-generating front side, significantly improving thermal management effectiveness.
Solution Approach 2:
The graphene layer acts as an intermediary thermal conduction path between the memory devices and the substrate. It facilitates efficient heat transfer from the front side of memory devices through the substrate to heat radiating structures, enabling effective thermal management without requiring direct attachment of large heat sinks to the backside.
3Temperature
If graphene layer is added for thermal management, then heat conduction is improved, but manufacturing complexity increases
Solution Approach 1:
The patent changes the material parameter by using graphene, which has exceptional thermal conductivity properties. This material parameter change enables superior heat conduction through a very thin layer, achieving effective thermal management without increasing component thickness or requiring complex thermal management structures.
Solution Approach 2:
The patent uses graphene as a composite material layer integrated into the substrate structure. This composite approach combines the substrate's mechanical support function with graphene's superior thermal conduction properties, achieving enhanced thermal management while maintaining structural integrity and using established deposition techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The high thermal conductivity of graphene enhances heat dissipation efficiency, reducing the need for bulky heat sinks and improving airflow, while maintaining electrical integrity and allowing for effective heat exchange with cooling gases.
Implementation Method 1
The graphene layer is configured to convey thermal energy away from the memory die
Data Source
AI summary
Systems, apparatuses, and methods relating to memory devices and packaging are described. A device, such as a dual inline memory module (DIMM) or other electronic device package, may include a substrate with a layer of graphene configured to conduct thermal energy (e.g., heat) away from components mounted or affixed to the substrate. In some examples, a DIMM includes an uppermost or top layer of graphene that is exposed to the air and configured to allow connection of memory devices (e.g., DRAMs) to be soldered to the conducting pads of the substrate. The graphene may be in contact with parts of the memory device other than the electrical connections with the conducting pads and may thus be configured as a heat sink for the device. Other thin, conductive layers of may be used in addition to or as an alternative to graphene. Graphene may be complementary to other heat sink mechanisms.