Graphene-Metal Layer Stacks for Out-of-Plane Conductivity

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Solution Overview

Problem

Graphene's poor out-of-plane conductivity hinders its application in integrated assemblies, necessitating improved materials with enhanced inter-layer conductivity.

Innovation Solution

Incorporating transition metals between graphene layers to create conductive bridges, enhancing out-of-plane conductivity in graphene-containing materials.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If pure graphene layers are used, then in-plane electrical conductivity is high, but out-of-plane electrical conductivity is poor

Engineering Contradiction:
Improveout-of-plane electrical conductivityVSAvoidgraphene structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent creates a composite material by combining graphene layers with transition metal atoms (such as tungsten, molybdenum, or tungsten carbide) inserted between the graphene planes. This composite structure leverages the high in-plane conductivity of graphene while the transition metal components provide conductive pathways in the out-of-plane direction, resolving the contradiction between maintaining graphene's inherent conductivity and improving out-of-plane transport.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

Transition metal atoms serve as intermediary elements positioned between graphene layers to facilitate charge transport across layers. These intermediary atoms create conductive bridges that enable electrons to move between graphene planes, thereby improving out-of-plane conductivity without disrupting the intrinsic properties of the graphene layers themselves.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If transition metals are inserted between graphene layers, then out-of-plane conductivity is improved, but manufacturing complexity increases

Engineering Contradiction:
Improveout-of-plane electrical conductivityVSAvoidgraphene material fabrication
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The transition metal atoms are inserted between graphene layers during the synthesis process before the final material structure is completed. This preliminary action of pre-positioning the conductive intermediaries during fabrication simplifies the overall manufacturing process compared to attempting to add them later, as the insertion occurs while the graphene structure is being formed or is most accessible.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent utilizes changes in physical and chemical parameters during synthesis (such as temperature, pressure, and chemical environment) to control the insertion of transition metal atoms between graphene layers. By adjusting these parameters, the manufacturing process can be optimized to achieve the desired composite structure with controlled metal atom positioning and concentration, making the fabrication more manageable.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables graphene-containing structures to achieve both intra- and inter-plane conductivity, facilitating their integration into advanced electronic systems and circuits.

Implementation Method 1

A metal, M, is provided within the region 14 to provide a conductive bridge between the layers 12 and to thereby improve out-of-plane conductivity of the material 10

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS20250273574A1Integrated Assemblies Having Graphene-Containing-Structures
Publication Date: 2025.08.28 MICRON TECHNOLOGY INC
  • US20250273574A1 patent drawing
  • US20250273574A1 patent drawing
  • US20250273574A1 patent drawing

AI summary

Some embodiments include an integrated assembly having a first graphene-containing-material offset from a second graphene-containing-material. The first graphene-containing-material includes a first graphene-layer-stack with first metal interspersed therein. The second graphene-containing-material includes a second graphene-layer-stack with second metal interspersed therein. A conductive interconnect couples the first and second graphene-containing materials to one another.