Graphene Molding Compound for Void-Free Semiconductor Package Cooling
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Solution Overview
Problem
Conventional semiconductor packaging materials face challenges with limited thermal conductivity, moisture absorption, increased weight and cost due to thermal additives, and reduced electrical resistivity, which hinder effective heat dissipation and reliability in high-performance devices.
Innovation Solution
A thermally enhanced molding compound incorporating graphene or graphite materials with high thermal conductivity and electrical resistivity, dispersed throughout the compound to prevent air pockets and voids, while maintaining low density and cost, is used to encapsulate semiconductor dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional thermal additives (silicon oxide, alumina, boron nitride, aluminum nitride, gold, or cooper) are introduced into molding compounds to enhance thermal performance, then thermal conductivity is improved, but moisture absorption increases causing air pockets or voids during reliability testing
Solution Approach 1:
The patent uses graphene or graphite particles as thermal additives in the molding compound. These carbon-based materials form a composite structure that provides high thermal conductivity while being hydrophobic, thus preventing moisture absorption and the formation of air pockets or voids during reliability testing.
Solution Approach 2:
The patent changes the material parameter from conventional thermal additives to graphene or graphite particles, which have inherently different properties including hydrophobicity. This parameter change resolves the contradiction by providing both high thermal conductivity and moisture resistance simultaneously.
2Temperature
If conventional thermal additives are introduced into molding compounds to enhance thermal performance, then thermal conductivity is improved, but package weight increases
Solution Approach 1:
The patent employs graphene or graphite particles as thermal additives, creating a composite molding compound that achieves high thermal conductivity with minimal weight addition. Carbon-based materials have favorable density characteristics compared to metal additives like gold or copper.
Solution Approach 2:
The patent uses carbon-based thermal additives (graphene or graphite) that provide effective thermal management without the weight penalty of precious metals. These materials offer a cost-effective and lightweight alternative to conventional thermal additives.
3Temperature
If conventional thermal additives are introduced into molding compounds to enhance thermal performance, then thermal conductivity is improved, but electrical resistivity decreases
Solution Approach 1:
The patent uses graphene or graphite particles as thermal additives in the molding compound. These carbon-based materials provide high thermal conductivity while maintaining electrical resistivity, as the particles are dispersed in the polymer matrix which acts as an electrical insulator, preventing the formation of conductive pathways.
4Temperature
If conventional thermal additives are introduced into molding compounds to enhance thermal performance, then thermal conductivity is improved, but manufacturing cost increases
Solution Approach 1:
The patent uses carbon-based thermal additives (graphene or graphite) that are more cost-effective than precious metal additives like gold or copper. These materials provide effective thermal management at a lower cost, improving the manufacturing economics of the semiconductor package.
Solution Approach 2:
The patent employs graphene or graphite particles as thermal additives, creating a composite molding compound that achieves high thermal conductivity with cost-effective materials. The carbon-based additives are less expensive than conventional thermal additives while providing comparable or superior thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly enhances thermal dissipation performance, maintains high electrical resistivity, and prevents moisture absorption, thereby ensuring reliable operation and cost-effectiveness in high-performance semiconductor packages.
Implementation Method 1
The thermal additive has a thermal conductivity larger than 450 W/m·K
Implementation Method 2
these thermal additives may cause moisture problems (i.e., the molding compounds may absorb undesired moisture due to the added thermal additives)
Data Source
AI summary
The present disclosure relates to a semiconductor package with a thermally enhanced molding compound. The disclosed semiconductor package includes a module carrier having an upper surface, a die formed over the upper surface of the module carrier, and a thermally enhanced molding compound component formed over the upper surface of module carrier to encapsulate the die. Herein, the thermally enhanced molding compound is formed from a molding compound mixed with a thermal additive and has no air pockets or voids. The thermal additive includes a number of carbon flakes or a number of carbon spherical particles. The thermal additive has a thermal conductivity larger than 450 W/m·K and an electrical resistivity larger than 90 μΩ.cm. In one embodiment, the thermal additive includes a number of graphene flakes, a number of graphene particles, a number of graphite flakes, or a number of graphite particles.