Graphene-Coated RDL Structure for Lower-Cost SIP Interconnects
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Solution Overview
Problem
Semiconductor devices with multilayer substrates for electrical interconnects are costly to manufacture, and there is a need for a more efficient and cost-effective method to form redistribution layers (RDLs) that enhance electrical conductivity and reduce manufacturing costs.
Innovation Solution
The use of graphene-coated cores embedded within a matrix in the redistribution layer (RDL) to improve electrical conductivity and thermal dissipation, combined with a single-layer substrate to minimize manufacturing complexity and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multilayer substrates are used for electrical interconnects, then electrical conductivity and interconnect functionality are improved, but manufacturing cost increases
Solution Approach 1:
The patent combines multiple interconnect layers into a single substrate layer, integrating the functions of multiple layers into one monolithic structure. This merging approach maintains the electrical interconnect functionality while eliminating the complexity and cost of manufacturing separate multilayer substrates.
Solution Approach 2:
The single substrate is designed to perform multiple functions simultaneously - providing both structural support and electrical interconnect pathways. By making the substrate multi-functional, the patent eliminates the need for separate dedicated interconnect layers, reducing manufacturing complexity while maintaining conductivity.
2Reliability
If multilayer substrates are used for electrical interconnects, then interconnect functionality is improved, but device complexity increases
Solution Approach 1:
Multiple interconnect layers are merged into a single substrate structure, reducing the number of discrete components and interfaces. This simplification maintains interconnect functionality while lowering device complexity and manufacturing difficulty.
3Ease of manufacture
If conventional RDL methods are used, then manufacturing process is simple, but electrical conductivity and thermal dissipation are insufficient
Solution Approach 1:
The patent employs composite materials in the RDL structure, combining conductive fillers with polymer matrices to achieve superior electrical conductivity and thermal dissipation properties. This composite approach maintains manufacturing simplicity while dramatically improving electrical and thermal performance.
Solution Approach 2:
The invention changes key material parameters by incorporating high-conductivity fillers and optimizing the composite structure, thereby enhancing electrical conductivity and thermal dissipation without fundamentally altering the manufacturing process complexity.
4Ease of manufacture
If conventional RDL methods are used, then manufacturing process is simple, but thermal dissipation is insufficient
Solution Approach 1:
Thermally conductive composite materials are used in the RDL structure, incorporating high thermal conductivity fillers that enable efficient heat dissipation while maintaining compatibility with existing manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The graphene-coated core RDLs provide high electrical conductivity and thermal management, reducing manufacturing costs and enabling miniaturization of semiconductor devices while maintaining high propagation speeds.
Implementation Method 1
graphene-coated core RDLs provide high electrical conductivity
Implementation Method 2
thermal dissipation
Data Source
AI summary
A semiconductor device has a one-layer interconnect substrate and electrical component disposed over a first surface of the interconnect substrate. The electrical components can be discrete electrical devices, IPDs, semiconductor die, semiconductor packages, surface mount devices, and RF components. An RDL with a graphene core shell is formed over a second surface of the interconnect substrate. The graphene core shell has a copper core and a graphene coating formed over the copper core. The RDL further has a matrix to embed the graphene core shell. The graphene core shells through RDL form an electrical path. The RDL can be thermoset material or polymer or composite epoxy type matrix. The graphene core shell is embedded within the thermoset material or polymer or composite epoxy type matrix. The RDL with graphene core shell is useful for electrical conductivity and electrical interconnect within an SIP.