Graphene Shield for 3D IC EMI and Thermal Management

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Solution Overview

Problem

Three-dimensional integrated circuits (3DICs) face challenges with heat dissipation and electromagnetic interference (EMI) due to increased component density, leading to performance degradation and potential non-compliance with regulatory limits.

Innovation Solution

Incorporating a graphene layer between semiconductor tiers in 3DICs to act as both an EMI shield and a heat sink, reducing crosstalk and dissipating heat effectively.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If component density is increased in 3DICs, then device packing density is improved, but heat dissipation becomes more difficult and EMI increases

Engineering Contradiction:

Improvecomponent densityVSAvoidheat dissipation

Core Design Contradiction:

Quantity of substanceVSTemperature

Solution Approach 1:

A graphene layer is introduced as an intermediary between adjacent semiconductor tiers to serve dual functions: as a thermal intermediary to conduct heat away from dense components, and as an electromagnetic intermediary to block EMI/crosstalk between tiers

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent uses graphene, a composite material with exceptional thermal and electrical properties, to simultaneously address heat dissipation and EMI shielding requirements in the high-density 3DIC structure

Inventive Principle:

Principle #40Composite materials

2Quantity of substance

If component density is increased in 3DICs, then device packing density is improved, but electromagnetic interference (EMI) and crosstalk increase

Engineering Contradiction:

Improvecomponent densityVSAvoidelectromagnetic interference

Core Design Contradiction:

Quantity of substanceVSObject-affected harmful factors

Solution Approach 1:

The graphene layer acts as an electromagnetic intermediary that blocks EMI and crosstalk between adjacent tiers while allowing the high-density component arrangement to continue

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

A thin graphene film is used to provide EMI shielding between tiers without adding significant volume, maintaining the compact 3DIC structure while protecting against electromagnetic interference

Inventive Principle:

Principle #30Flexible shells and thin films

3Object-affected harmful factors

If graphene layer is added between tiers, then EMI shielding and heat dissipation are improved, but device complexity increases

Engineering Contradiction:

ImproveEMI reductionVSAvoidstructure complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The graphene layer performs multiple functions simultaneously - thermal conduction, EMI shielding, and structural support - thereby improving performance without proportionally increasing device complexity

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The use of a thin graphene film rather than a bulky structure provides the necessary shielding and thermal management functions with minimal added complexity to the overall device architecture

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The graphene layer significantly reduces EMI and enhances heat dissipation, improving the performance and regulatory compliance of 3DICs by minimizing thermal issues and electromagnetic interference.

Implementation Method 1

the graphene layer provides a heat sink that directs and dissipates heat to peripheral areas or heat sink of the 3DIC

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the graphene layer provides an electromagnetic interference (EMI) shield between adjacent tiers or layers in the 3DIC to reduce crosstalk between the tiers

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS9536840B2Three-dimensional (3-D) integrated circuits (3DICS) with graphene shield, and related components and methods

Publication Date: 2017.01.03 QUALCOMM INC

AI summary

A three-dimensional (3-D) integrated circuit (3DIC) with a graphene shield is disclosed. In certain embodiments, at least a graphene layer is positioned between two adjacent tiers of the 3DIC. A graphene layer is a sheet like layer made of pure carbon, at least one atom thick with atoms arranged in a regular hexagonal pattern. A graphene layer may be disposed between any number of adjacent tiers in the 3DIC. In exemplary embodiments, the graphene layer provides an electromagnetic interference shield between adjacent tiers or layers in the 3DIC to reduce crosstalk between the tiers. In other exemplary embodiments, the graphene layer(s) can be disposed in the 3DIC to provide a heat sink that directs and dissipates heat to peripheral areas of the 3DIC. In some embodiments, the graphene layer(s) are configured to provide both EMI shielding and heat shielding.