Flexible Semiconductor Device Using Graphene Tape Encapsulation

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Solution Overview

Problem

Conventional semiconductor packages using encapsulant materials like plastic or ceramic are rigid, making them unsuitable for wearable devices, which require flexible and low-cost solutions.

Innovation Solution

A flexible semiconductor device is assembled using a first tape with bonding pads and conductive traces, a semiconductor die electrically connected to the pads, and a second tape that encapsulates the die and traces, with the option of a metal plate for protection and a non-conductive layer for locking electrical contacts, all potentially using graphene for enhanced flexibility and performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If conventional encapsulant materials like plastic or ceramic are used, then the semiconductor package has good protection and structural integrity, but the device becomes rigid and unsuitable for wearable applications

Engineering Contradiction:

Improveprotection and structural integrityVSAvoidflexibility for wearable devices

Core Design Contradiction:

StrengthVSAdaptability or versatility

Solution Approach 1:

The patent replaces conventional rigid encapsulant materials with flexible tape materials that can be bent and conform to wearable device surfaces. The tape material provides both protection and flexibility, resolving the contradiction between structural integrity and adaptability for wearable applications.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent uses composite structures combining tape material with semiconductor die and conductive traces. This composite approach maintains protection while enabling flexibility, as the tape material can be engineered to provide both mechanical strength and bendability for wearable devices.

Inventive Principle:

Principle #40Composite materials

2Stability of the object's composition

If conventional rigid packaging materials are used, then the device has good structural stability, but it lacks flexibility required for wearable devices

Engineering Contradiction:

Improvestructural stabilityVSAvoidflexibility

Core Design Contradiction:

Stability of the object's compositionVSAdaptability or versatility

Solution Approach 1:

The flexible tape material serves as both the encapsulant and structural element, providing stability through its design while maintaining flexibility. The tape can be engineered with appropriate thickness, composition, and mechanical properties to achieve both stability and bendability for wearable applications.

Inventive Principle:

Principle #30Flexible shells and thin films

3Adaptability or versatility

If graphene tape is used instead of conventional materials, then flexibility and heat dissipation are improved, but manufacturing complexity may increase

Engineering Contradiction:

ImproveflexibilityVSAvoidmanufacturing complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent changes the material parameter from conventional encapsulant to graphene tape, which provides superior flexibility and heat dissipation. The manufacturing process is adapted to work with graphene tape materials, balancing the improved performance characteristics with manageable manufacturing complexity.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS11456188B2Method of making flexible semiconductor device with graphene tape

Publication Date: 2022.09.27 NXP USA INC

AI summary

A flexible semiconductor device includes a first tape having bonding pads and conductive traces formed. A semiconductor die having a bottom surface is attached to the first tape and electrically connected to the bond pads by way of electrical contacts. A second tape is attached to a top surface of the semiconductor die. The first and second tapes encapsulate the semiconductor die, the electrical contacts, and at least a part of the conductive traces.