Graphene-Templated Single-Crystal Copper for Low-Loss High-Speed PCBs
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Solution Overview
Problem
The high surface roughness of copper materials in existing technologies leads to significant signal transmission loss, limiting their application in high-frequency and high-speed signal transmission.
Innovation Solution
A method to form a single-crystal copper layer on a graphene layer substrate in a mixed gas atmosphere of argon and hydrogen at 800-1065°C with a volume ratio of (10-20):1, followed by peeling off the copper layer, which replicates the low surface roughness of graphene and enhances the single-crystal property, reducing transmission loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional copper material is used in the signal layer, then the material has excellent electrical conductivity and low price, but the surface roughness is relatively high causing high transmission loss
Solution Approach 1:
The patent changes the physical and chemical parameters of copper material by controlling the formation process in a mixed gas atmosphere of argon and hydrogen at specific temperature ratios, transforming the copper layer into a single-crystal structure with reduced surface roughness while maintaining electrical conductivity
Solution Approach 2:
The patent uses a composite approach by forming copper layer on graphene substrate and peeling it off, combining the low roughness property of graphene with the high conductivity of copper to achieve a copper material with both low surface roughness and excellent electrical properties
2Manufacturing precision
If the copper layer is formed on graphene layer substrate, then the surface roughness is reduced, but the bonding force between copper layer and substrate is weak making peeling difficult
Solution Approach 1:
The patent performs preliminary actions by forming the copper layer on the graphene substrate under controlled conditions first, then subsequently peeling it off, allowing the weak bonding to be exploited in the separation step while maintaining the low roughness surface quality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in a low-transmission-loss single-crystal copper material with improved etching performance, reducing surface roughness and signal transmission loss, comparable to high-end copper foils, facilitating high-frequency and high-speed signal transmission.
Implementation Method 1
forming a single-crystal copper layer on a substrate whose surface is a graphene layer
Implementation Method 2
forming a single-crystal copper layer on a substrate whose surface is a graphene layer, in a mixed gas atmosphere of argon and hydrogen
Data Source
AI summary
The present disclosure relates to the technical field of copper material preparation, in particular, to a low-transmission-loss single-crystal copper material and a preparation method thereof, a PCB and a preparation method thereof and an electronic component. The preparation method of the low-transmission-loss single-crystal copper material includes: forming a single-crystal copper layer on a substrate with a graphene layer on the surface in a mixed gas atmosphere of argon and hydrogen and at a temperature of 800-1065° C., then peeling off the single-crystal copper layer from the substrate. The volume ratio of argon and hydrogen in the mixed gas is (10-20):1. The preparation method of the low-transmission-loss single-crystal copper material provided by the present disclosure can significantly reduce the surface roughness Rz of the formed copper material, which is beneficial to further reducing the transmission loss of the entire low-transmission-loss single-crystal copper material, and the preparation method is simple and easy to operate.