Graphene-Coated TIM Structure for Semiconductor Heat Dissipation
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Solution Overview
Problem
Existing semiconductor devices face challenges in effectively dissipating heat generated by high-speed digital and RF electrical components, particularly in applications requiring high power and small form factors.
Innovation Solution
Incorporating a graphene-coated copper core within thermal interface material (TIM) to enhance heat dissipation by creating a thermal path between electrical components and a heat sink, leveraging graphene's high thermal conductivity and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional thermal interface materials are used, then manufacturing cost is reduced, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent uses composite materials by combining graphene-coated copper cores with traditional thermal interface material matrix. The graphene coating on copper cores provides superior thermal conductivity while the traditional TIM matrix maintains manufacturing compatibility. This composite structure achieves enhanced heat dissipation efficiency without significantly increasing manufacturing complexity or cost.
Solution Approach 2:
The patent changes the thermal conductivity parameter of the thermal interface material by incorporating graphene-coated copper cores. The graphene coating dramatically increases the thermal conductivity of the copper cores, which in turn enhances the overall thermal performance of the TIM. This parameter change allows efficient heat dissipation while maintaining reasonable manufacturing costs.
2Loss of energy
If high thermal conductivity materials are used, then heat dissipation is improved, but device stability against warpage deteriorates
Solution Approach 1:
The patent applies local quality by using graphene coating specifically on the copper cores where high thermal conductivity is needed, while the surrounding TIM matrix maintains its original mechanical properties. This localized enhancement of thermal properties without altering the bulk material composition prevents warpage issues while achieving superior heat dissipation at the critical heat transfer interfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves thermal conductivity and reduces manufacturing costs while maintaining stability against warpage, enabling efficient heat dissipation and reducing the likelihood of device failure.
Implementation Method 1
Incorporating a graphene-coated copper core within thermal interface material (TIM) to enhance heat dissipation by creating a thermal path between electrical components and a heat sink, leveraging graphene's high thermal conductivity
Data Source
AI summary
A semiconductor device has a substrate and electrical component disposed over the substrate. The electrical component can be a semiconductor die, semiconductor package, surface mount device, RF component, discrete electrical device, or IPD. A TIM is deposited over the electrical component. The TIM has a core, such as Cu, covered by graphene. A heat sink is disposed over the TIM, electrical component, and substrate. The TIM is printed on the electrical component. The graphene is interconnected within the TIM to form a thermal path from a first surface of the TIM to a second surface of the TIM opposite the first surface of the TIM. The TIM has thermoset material or soldering type matrix and the core covered by graphene is embedded within the thermoset material or soldering type matrix. A metal layer can be formed between the TIM and electrical component.