Graphene-Embedded Thermal Interface Pad for Heat Dissipation
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Solution Overview
Problem
Thermal interface materials (TIMs) have limited thermal conductivity, typically ranging from 1 to 5 W/mK, which is insufficient for efficient heat transfer between electronic components, and they struggle to fill surface imperfections effectively due to their rigidity and low thermal conductivity of air.
Innovation Solution
A TIM pad is designed with alternating layers of flexible TIM materials and graphene, where graphene layers are interposed between the TIM layers, enhancing thermal conductivity by up to 141 W/mK in the perpendicular direction while maintaining compressibility to fill surface imperfections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional TIM materials are used, then the material can be flexible and fill surface imperfections, but the thermal conductivity is limited to 1-5 W/mK which is insufficient for efficient heat transfer
Solution Approach 1:
The patent creates a composite structure by stacking multiple TIM layers with graphene layers interposed between them. This composite design combines the flexibility and gap-filling capability of traditional TIM materials with the high thermal conductivity of graphene, achieving thermal conductivity of up to 141 W/mK while maintaining the ability to conform to surface imperfections.
2Temperature
If less flexible but thermally conductive materials like aluminum are used, then thermal conductivity is improved, but the ability to fill surface imperfections is lost
Solution Approach 1:
The patent segments the TIM structure into multiple thin layers separated by graphene interlayers. This segmentation allows each TIM layer to remain thin and flexible for conforming to surfaces, while the cumulative effect of multiple layers with high-conductivity graphene spacers achieves overall high thermal conductivity comparable to rigid materials like aluminum.
3Volume of moving object
If air gaps are present between components, then the TIM can be thinner, but heat transfer efficiency is reduced due to air's poor thermal conductivity of 0.024 W/mK
Solution Approach 1:
The patent fundamentally changes the thermal conductivity parameter by introducing graphene layers with extremely high thermal conductivity between TIM layers. This parameter change compensates for the reduced TIM thickness and eliminates the negative effect of air gaps, achieving high heat transfer efficiency in a thinner overall structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integration of graphene layers significantly increases the thermal conductivity of the TIM pad, improving heat dissipation efficiency between electronic components by filling air gaps and adhering to surfaces, thereby enhancing thermal transfer.
Implementation Method 1
graphene layers are interposed between the TIM layers, enhancing thermal conductivity by up to 141 W/mK in the perpendicular direction
Implementation Method 2
maintaining compressibility to fill surface imperfections
Data Source
Figure 1A~1B
Figure 2
Figure 3A~3C
AI summary
A thermal interface material (TIM) pad is disclosed for dissipating heat from a component. The TIM pad includes a plurality of thermal interface material layers and at least one graphene layer interposed between the plurality of TIM layers. A method for forming the TIM pad includes stacking the plurality of TIM layers with at least one graphene layer interposed between the plurality of TIM layers to reach a length for the TIM pad. The stacked layers are cut corresponding to a thickness for the TIM pad for compression against the component.