Graphene Device Fabrication via Pre-Patterned Trenches

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Solution Overview

Problem

Current graphene device fabrication methods are rudimentary and challenging due to the difficulty in handling and patterning graphene layers, particularly in achieving small sizes and precise control over device structures.

Innovation Solution

The process involves forming a trench in one or more layers of material and growing a graphene layer within the trench, allowing for pre-defined device structures and eliminating the need for etching, thereby simplifying the fabrication process and enhancing control over device dimensions and structures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If current fabrication methods are used to pattern graphene layers, then device structures can be formed, but the process becomes complex and difficult to control at small sizes

Engineering Contradiction:
Improvedevice structure controlVSAvoidfabrication process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by pre-forming trenches in the substrate before growing the graphene layer. The trenches are created with precise dimensions and patterns using standard semiconductor fabrication techniques, establishing the device structure boundaries in advance. This preliminary structuring eliminates the need for subsequent graphene etching and patterning steps, significantly simplifying the fabrication process while maintaining precise control over device dimensions and structures.

Inventive Principle:
Principle #10Preliminary action

2Length of moving object

If graphene layers are etched to small sizes, then device dimensions are reduced, but handling and patterning become increasingly difficult

Engineering Contradiction:
Improvedevice sizeVSAvoidgraphene handling
Core Design Contradiction:
Length of moving objectVSEase of operation

Solution Approach 1:

The patent applies inversion by reversing the conventional fabrication sequence. Instead of growing a large graphene layer and then etching it down to small device dimensions, the method grows the graphene layer conformally within pre-formed trenches that already define the small device dimensions. This inverted approach eliminates the need to handle and etch small graphene structures, making the process much easier to execute while achieving the same small device sizes.

Inventive Principle:
Principle #13The other way round (Inversion)

3Reliability

If conventional patterning methods are used, then device structures are formed, but process control and reliability are compromised

Engineering Contradiction:
Improveprocess controlVSAvoidfabrication simplicity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent introduces trenches as an intermediary structure that mediates between the substrate and the graphene layer. These trenches serve as physical templates that guide graphene growth and automatically define device boundaries. By using trenches as intermediaries, the method achieves superior process control and reliability compared to direct graphene patterning, while simultaneously simplifying the overall fabrication process by eliminating multiple etching and alignment steps.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS7858990B2Device and process of forming device with pre-patterned trench and graphene-based device structure formed therein
Publication Date: 2010.12.28 ADVANCED MICRO DEVICES INC
  • US7858990B2 patent drawing
  • US7858990B2 patent drawing
  • US7858990B2 patent drawing

AI summary

A graphene-based device is formed with a trench in one or more layers of material, a graphene layer within the trench, and a device structure on the graphene layer and within the trench. Fabrication techniques includes forming a trench defined by one or more layers of material, forming a graphene layer within the trench, and forming a device structure on the graphene layer and within the trench.