High Frequency Transmit-Receive Device With Graphene Waveguide
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Solution Overview
Problem
Existing extremely high frequency electromagnetic wave transmit/receive devices experience significant losses during wave transmission between the antenna and waveguide, and have high manufacturing costs.
Innovation Solution
The device incorporates a multilayer organic substrate with an integrated circuit chip bonded via flip-chip assembly, a package with a first cavity containing the substrate and chip, and a second cavity forming a waveguide, utilizing an electrically-insulating organic support and a graphene coating to minimize losses and reduce manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional substrate materials and structures are used, then manufacturing cost is reduced, but transmission losses increase
Solution Approach 1:
The patent employs a composite structure combining organic substrate materials with metallic waveguide components. The organic substrate provides low-cost manufacturing and integration benefits, while the metallic waveguide sections ensure low transmission losses at extremely high frequencies. This composite approach allows the device to achieve both cost-effectiveness and low energy loss by leveraging the complementary strengths of different materials in different functional zones.
2Ease of manufacture
If organic substrate is used, then manufacturing cost decreases, but transmission losses may increase
Solution Approach 1:
The patent applies local quality by using organic substrate materials specifically in regions where cost reduction is prioritized (such as the integrated circuit chip substrate and packaging), while employing traditional metallic waveguide structures in the electromagnetic wave transmission paths where low loss is critical. This spatial differentiation of material properties allows simultaneous optimization of both manufacturing cost and transmission efficiency.
3Loss of energy
If complex packaging structure is used, then transmission losses decrease, but device complexity increases
Solution Approach 1:
The patent merges the substrate function and packaging function into a unified organic substrate structure. The organic substrate serves dual purposes as both the mounting platform for the integrated circuit chip and the packaging material that forms part of the waveguide structure. This consolidation reduces the number of separate components and assembly steps, thereby reducing device complexity while maintaining low transmission losses through the integrated design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces transmission losses and decreases manufacturing costs by using a multilayer organic substrate with an electrically-insulating support and graphene coating, effectively addressing the inefficiencies and cost issues of existing devices.
Implementation Method 1
The multilayer organic substrate further comprises a coating comprising a graphene layer covering the electrically-insulating layer
Data Source
AI summary
The present description concerns an electromagnetic wave transmit/receive device comprising a multilayer organic substrate, an integrated circuit chip, flip-chip assembled on the multilayer organic substrate, a package comprising a first cavity, containing the multilayer organic substrate and the integrated circuit chip, and communicating over a channel with a second cavity forming a waveguide for electromagnetic waves.