Graphite Thermal Conduit Spring for Rotatable Device Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Portable information handling systems face challenges with thermal management due to limited passive thermal dissipation capabilities in low profile configurations, leading to excessive mechanical stress and reduced processing performance from heat buildup, especially in convertible designs where rotationally coupled housing portions increase thickness and restrict active cooling.
Innovation Solution
A system and method that utilize a thermal conduit to transfer heat from one housing portion to another, integrating vapor chambers and graphite thermal conduits to manage thermal energy dissipation across a greater surface area, allowing for dynamic control of thermal transfer and distribution through hinges, thereby enhancing passive cooling and maintaining component temperatures within safe limits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a low profile configuration is used, then the device thickness is reduced, but passive thermal dissipation capability deteriorates
Solution Approach 1:
The patent extends thermal management from a single housing portion to multiple housing portions by rotating the second housing portion to a predetermined angle, utilizing three-dimensional spatial arrangement to distribute heat across greater surface area without increasing device thickness in the closed state
Solution Approach 2:
The patent employs a dynamic hinge mechanism that allows the second housing portion to rotate between different angular positions, enabling adaptive thermal dissipation where the housing configuration can change based on thermal management needs while maintaining a compact closed profile
2Area of stationary object
If rotationally coupled housing portions are used, then thermal dissipation surface area is increased, but device thickness is increased
Solution Approach 1:
The patent utilizes angular rotation of the second housing portion to expose previously internal surfaces to the external environment, converting internal heat generation zones into external dissipation surfaces without requiring linear thickness increase
Solution Approach 2:
The hinge mechanism enables dynamic reconfiguration of housing portions to optimize thermal dissipation surface area exposure while maintaining a compact profile when rotation is not required, allowing the device to adapt between thickness and surface area needs
3Device complexity
If active cooling is restricted, then device complexity is reduced, but thermal management capability deteriorates
Solution Approach 1:
The patent employs passive thermal dissipation mechanisms where the housing structure itself serves as the cooling system, utilizing natural convection and radiation from exposed surfaces without requiring active cooling components
Solution Approach 2:
The housing portions serve dual functions: providing structural enclosure and acting as thermal dissipation surfaces, eliminating the need for separate dedicated cooling components and reducing overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively increases passive thermal dissipation efficiency, reduces component temperatures, and allows for higher processing power by distributing heat across a larger surface area, maintaining performance while minimizing user discomfort and mechanical stress.
Implementation Method 1
A system and method that utilize a thermal conduit to transfer heat from one housing portion to another, integrating vapor chambers and graphite thermal conduits to manage thermal energy dissipation
Implementation Method 2
integrating vapor chambers and graphite thermal conduits to manage thermal energy dissipation
Data Source
AI summary
A portable information handling system transfers thermal energy associated with operation of processing components between rotationally coupled housing portions through a thermal spreader disposed between the housing portions, such as a sheet having one or more layers of graphite. A tensioning assembly engages the thermal sheet to manage excess material associated with varying rotational orientations of the housing portions.