Graphite-Copper Composite Interface Control for High Heat Dissipation
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Solution Overview
Problem
The increasing demand for heat dissipation in advanced technologies such as IoT, AI, and electric vehicles requires a graphite-copper composite material with thermal conductivity exceeding 600 W/(m·K), specifically aiming for 850 W/(m·K), which conventional materials cannot achieve effectively.
Innovation Solution
A graphite-copper composite material is developed with a copper oxide layer thickness of 100 nm or less at the interface between graphite particles and the copper layer, using scaly graphite particles and copper particles with an oxygen concentration of 0.40% or less, sintered via a multiaxial electric current method to enhance thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional graphite-copper composite materials are used, then the thermal conductivity is about 600 W/(m·K), but it is insufficient for high-demand applications requiring 850 W/(m·K) or higher
Solution Approach 1:
The invention changes the critical parameter of copper oxide layer thickness at the graphite-copper interface to 100 nm or less. This parameter change dramatically improves thermal conductivity from conventional 600 W/(m·K) to 850 W/(m·K) or higher, while maintaining cooling reliability through optimized interface structure
Solution Approach 2:
The invention uses a composite material structure combining scaly graphite particles with copper matrix, where the graphite provides high thermal conductivity pathways and the copper provides structural stability and electrical conductivity, achieving synergistic thermal performance exceeding 850 W/(m·K)
2Temperature
If the copper oxide layer thickness is not controlled, then the material can be manufactured conventionally, but the thermal conductivity does not exceed 600 W/(m·K)
Solution Approach 1:
The invention performs preliminary oxidation control during the sintering process to form a thin copper oxide layer (≤100 nm) before final densification. This preliminary action ensures optimal thermal interface structure is established early, enabling high thermal conductivity of 850 W/(m·K) or higher while maintaining manufacturability through controlled atmosphere sintering
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite material achieves a thermal conductivity of 780 W/(m·K) or more, significantly higher than conventional materials, while maintaining processability and mechanical stability, making it suitable for high-output electronic components.
Implementation Method 1
sintering a molded body, obtained by molding the molding raw material, by a multiaxial electric current sintering method
Data Source
AI summary
A graphite-copper composite material includes a copper layer and scaly graphite particles stacked via the copper layer. The graphite-copper composite material has a copper volume fraction of 3% to 30%. A thickness of a copper oxide layer at an interface between the copper layer and the scaly graphite particles is 100 nm at a maximum.