Graphite Fin Heat Sink with Localized Film Removal

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Solution Overview

Problem

Conventional heat sinks with graphite fins face challenges in achieving high heat dissipation performance due to large thermal resistance at the connection between the metal base and graphite fin, which impairs heat transfer efficiency and complicates miniaturization and weight reduction demands in electronic equipment.

Innovation Solution

A heat sink design featuring a metal base with a high heat dissipation film and a graphite fin, where the film is removed or filled with a higher conductivity material at the contact region to reduce thermal resistance, allowing effective heat conduction from the base to the fin, and optionally incorporating a bellows structure or laminate configuration for enhanced rigidity and heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If a high heat dissipation film is formed on the metal base surface, then heat dissipation performance is improved, but thermal resistance at the fin connection increases

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidheat transfer efficiency

Core Design Contradiction:

Loss of energyVSReliability

Solution Approach 1:

The patent applies local quality by differentiating the treatment of the base surface: the high heat dissipation film is formed on the exposed base surface to enhance radiative and convective heat dissipation, while the connection regions are intentionally left untreated or filled with high-conductivity material to minimize thermal resistance for heat conduction to fins.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent introduces a high heat conductivity filling material as an intermediary substance in the connection regions between the base and fins. This filling material mediates the thermal transfer, bridging the gap between the base and fin bases to reduce contact thermal resistance and improve heat conduction efficiency.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Weight of stationary object

If graphite fins are used to reduce weight, then weight is reduced, but thermal resistance at the connection increases

Engineering Contradiction:

Improveheat sink weightVSAvoidheat transfer efficiency

Core Design Contradiction:

Weight of stationary objectVSReliability

Solution Approach 1:

The patent employs composite materials by combining graphite fins with a metal base and high heat conductivity filling material. The graphite fins provide lightweight structure with inherent high thermal conductivity, while the filling material compensates for the thermal resistance at the graphite-metal interface, creating a synergistic composite heat dissipation system.

Inventive Principle:

Principle #40Composite materials

3Loss of energy

If the envelope volume is increased to improve heat dissipation, then heat dissipation performance is improved, but miniaturization requirements are compromised

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidheat sink volume

Core Design Contradiction:

Loss of energyVSVolume of stationary object

Solution Approach 1:

The patent changes the thermal parameters of the connection regions by filling them with high heat conductivity material, which significantly reduces thermal resistance. This parameter change allows for more efficient heat conduction within a compact volume, enabling high heat dissipation performance without increasing the overall envelope volume of the heat sink.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design achieves a lightweight heat sink with improved heat transfer performance by minimizing contact thermal resistance and leveraging the high conductivity of graphite, suitable for applications in electronic components like LEDs and LDs, while maintaining structural integrity and adhering to miniaturization and weight-saving requirements.

Implementation Method 1

Graphite used in the heat sink disclosed in Japanese Patent Application Laid-Open No. 2009-099878 has a high heat conductivity, and thus has been expected to show a higher heat dissipation performance.

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a base with a high heat dissipation film formed on its surface to be provided with a high heat dissipation performance

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS9978922B2Heat sink using graphite and light emitting device

Publication Date: 2018.05.22 STANLEY ELECTRIC CO LTD

AI summary

A heat sink can include a fin using graphite, and a base with a high heat dissipation film formed on its surface to be provided with a high heat dissipation performance. The heat sink can include a base made of metal and a fin fixed to the base. The fin can include a graphite sheet. The base has a surface coated with a film having a higher heat dissipation property than that of the metal constituting the base. The film of the base is removed from at least the region where the fin is fixed, so that the fin is fixed to the metal constituting the base.