Graphite Material with Flexible Part for Thin Device Heat Dissipation

The patent divides the thick graphite material into multiple thin polymer film layers (each ≤150 μm) stacked together. This segmentation allows gases to escape more easily during heat treatment of each individual layer, preventing gas entrapment while achieving the desired total thickness for heat radiation. The layered structure resolves the contradiction by maintaining manufacturing precision through controlled heat treatment of thin layers while still providing sufficient overall thickness for thermal management.

The patent applies preliminary heat treatment to each thin polymer film layer before final assembly into the thick graphite material. This preliminary action removes volatile components and prevents gas entrapment during subsequent heat treatment, ensuring high crystallinity and formability. By performing this action in advance on thin layers rather than attempting to treat a single thick layer, the patent resolves the contradiction between achieving thick material for heat radiation and maintaining manufacturing quality.

The patent applies different heat and pressure conditions to different regions or layers of the polymer film stack. By controlling the local quality of heat/pressure treatment, the patent produces a graphite material with varying degrees of crystallinity and density throughout its thickness. This allows the outer layers to maintain flexibility while inner layers provide structural integrity and heat radiation capability, thus resolving the contradiction between thickness and flexibility.

The patent varies the heat treatment temperature, pressure, and duration parameters across different layers or stages of processing. By changing these parameters locally or sequentially, the patent achieves a gradient structure where some regions remain more flexible while others provide rigid heat radiation. This parameter variation resolves the contradiction by allowing both thickness and flexibility to coexist in different parts of the same material.

The patent uses multiple thin polymer film layers as copies or substitutes for a single thick layer. Each thin layer can be independently processed and then stacked to achieve the equivalent thermal performance of a thick material while occupying less volumetric space. This copying approach resolves the contradiction by providing the necessary heat dissipation surface area without requiring excessive thickness, thus fitting within thin electronic devices.

The patent creates a composite structure by stacking multiple thin polymer films with potentially different compositions or treatments. This composite material achieves the desired heat dissipation performance through the combined effect of multiple thin layers, providing high surface area for heat radiation while maintaining overall thinness. The composite structure resolves the contradiction between heat dissipation efficiency and space occupation by optimizing the arrangement and properties of individual layers.