Graphite Heat Conductor for PCB Thermal Management
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Solution Overview
Problem
Existing cooling devices for electronic components suffer from poor thermal conductivity due to gaps between heat conducting covers and components, leading to high thermal resistance and inefficient heat transfer.
Innovation Solution
A cooling device design featuring a first heat sink thermally coupled to a heating component on one surface of a circuit board and a heat conductor thermally coupled to another heating component on the opposite surface, with the heat conductor made of graphite to enhance thermal conductivity and a flexible design that allows close contact without adhesives, using bag bodies and plate members to compress and bring the heat conducting unit into contact with the heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a heat conducting cover is separated from electronic components, then the cooling device structure is simpler, but thermal conductivity deteriorates due to gaps between components and cover
Solution Approach 1:
The patent introduces a heat conducting unit as an intermediary component between the electronic components and the heat sink. This unit fills the gap space and provides a continuous thermal conduction path, eliminating the thermal resistance caused by separation while maintaining structural simplicity. The heat conducting unit acts as a mediator that bridges the gap without requiring direct contact between components and cover.
Solution Approach 2:
The patent changes the physical state and properties of the gap space by filling it with heat conducting material. This transforms the gap from an insulating void into a thermally conductive medium, fundamentally changing the thermal parameters of the system while maintaining the separated structure.
2Reliability
If adhesive is used to bond heat conducting cover to components, then thermal contact is improved, but manufacturing process becomes more complex and reliability decreases
Solution Approach 1:
The patent extracts and eliminates the adhesive bonding process from the manufacturing workflow. Instead of using adhesives to achieve thermal contact, the design relies on direct thermal conduction through the heat conducting unit that fills the gap, removing the need for additional bonding steps and associated quality control issues.
Solution Approach 2:
The heat conducting unit performs the dual function of filling the gap space and providing thermal conduction pathways. The structure itself serves the thermal contact function without requiring external adhesives, achieving self-sufficient thermal management.
3Ease of operation
If gaps exist between heat conducting cover and components, then assembly is easier, but thermal resistance increases reducing cooling efficiency
Solution Approach 1:
The heat conducting unit serves as a mediator that fills the assembly gaps while maintaining thermal conduction. This allows the structure to accommodate assembly tolerances and variations without compromising heat transfer, as the heat conducting material conforms to the gap geometry and provides continuous thermal pathways.
Solution Approach 2:
The heat conducting unit utilizes porous or flexible heat conducting materials that can adapt to irregular gap geometries. These materials provide thermal conduction while accommodating variations in assembly precision, transforming the gap from a thermal barrier into an effective thermal conduction medium.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces thermal resistance and enhances heat transfer efficiency between heating components and the heat sink, allowing for effective cooling of both surfaces of the circuit board with a simpler configuration compared to existing methods.
Implementation Method 1
a heat conductor which is thermally coupled to a second heating component mounted on a second surface, of the circuit board and is thermally coupled to the first heat sink
Implementation Method 2
a first heat sink which is thermally coupled to a first heating component mounted on a first surface of a circuit board
Data Source
AI summary
The object of the present invention is to provide a cooling device capable of more efficiently cooling heating components heated. The cooling device has a first heat sink and a heat conductor. The first heat sink is thermally coupled to a first heating component mounted on a first surface of a circuit board. The heat conductor is thermally coupled to a second heating component mounted on a second surface of the circuit board and is thermally coupled to the first heat sink.