Graphite Heat Dissipation Member in Semiconductor Package
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor chips face challenges in being directly mounted on electronic device mainboards due to size and spacing differences, and they require packaging to protect against external impacts, which limits their integration density and heat dissipation capabilities, especially as they are designed to be thinner and more compact.
Innovation Solution
A semiconductor package design that includes a semiconductor chip with a heat dissipation member made of graphite, an adhesive member, and an encapsulant, along with an interconnect structure featuring a redistribution layer, to enhance heat dissipation and reduce thickness while addressing mounting challenges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a semiconductor chip is packaged to protect against external impacts, then reliability is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The heat dissipation member is embedded within the encapsulant structure, with the semiconductor chip mounted on top of the heat dissipation member. This nested arrangement allows the heat dissipation member to be integrated inside the protective packaging without increasing overall package volume, enabling simultaneous achievement of protection and heat dissipation.
Solution Approach 2:
The package combines multiple materials with different properties: the encapsulant provides mechanical protection and insulation, while the heat dissipation member (made of materials with high thermal conductivity) provides thermal management. This composite structure allows each material to perform its specialized function without interfering with the other.
2Length of moving object
If a semiconductor chip is designed with reduced thickness, then integration density is improved, but heat dissipation capability deteriorates
Solution Approach 1:
Instead of increasing chip thickness to improve heat dissipation, the solution extends the heat dissipation path in the vertical dimension by incorporating a dedicated heat dissipation member beneath the chip. This allows thin chips to maintain excellent heat dissipation by utilizing the Z-axis direction for thermal management.
3Volume of moving object
If a semiconductor package is designed with reduced size, then integration density is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The heat dissipation member is nested within the encapsulant volume, utilizing the same space that would otherwise be empty or filled with less functional material. This nested configuration allows the package to maintain compact size while incorporating an effective heat dissipation path through the vertical dimension.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves heat dissipation properties and allows for reduced thickness and compact integration of semiconductor packages, enabling better thermal management and reliability, even at high temperatures, while facilitating easier mounting on electronic device mainboards.
Implementation Method 1
a heat dissipation member disposed on the inactive surface of the semiconductor chip and including a graphite material
Data Source
AI summary
A semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface; a heat dissipation member disposed on the inactive surface of the semiconductor chip and including a graphite material; an adhesive member disposed between the semiconductor chip and the heat dissipation member; an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member; and an interconnect structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad. The encapsulant covers at least a portion of aside surface of the adhesive member.