Graphite Heat Spreader Package Layout for Chip Overheating
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Solution Overview
Problem
Existing semiconductor packages face challenges in achieving high thermal and mechanical performance while maintaining compactness and high circuit density, particularly in preventing chip overheating due to limited heat dissipation capabilities.
Innovation Solution
The use of a flexible graphite heat spreader with high thermal conductivity, attached to the chip and molding compound using a thermal interface material, facilitates efficient heat dissipation by providing a thermal path for heat generated by the chip to be dissipated horizontally, preventing overheating and improving mechanical protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional semiconductor package structures are used, then manufacturing simplicity is maintained, but thermal dissipation capability is insufficient leading to chip overheating
Solution Approach 1:
The patent introduces a heat spreader layer horizontally above the chip to dissipate heat in the lateral direction, complementing the vertical heat dissipation path through the substrate. This dimensional addition creates a two-path thermal management system that effectively reduces chip temperature without requiring complete redesign of the package architecture.
Solution Approach 2:
The patent employs a heat spreader made of thermally conductive material (such as metal or ceramic) combined with the existing package substrate materials. This composite structure leverages the high thermal conductivity of the heat spreader material to efficiently distribute and dissipate heat across a larger area, solving the thermal dissipation problem while maintaining material compatibility with standard manufacturing processes.
2Volume of moving object
If package size is reduced to meet compactness requirements, then device miniaturization is achieved, but heat dissipation area is reduced worsening thermal performance
Solution Approach 1:
By adding the heat spreader layer that extends heat dissipation in the horizontal plane, the patent effectively increases the thermal dissipation surface area without increasing the vertical height of the package. This allows compact packaging while maintaining adequate heat dissipation capability through lateral heat distribution.
Solution Approach 2:
The patent segments the heat dissipation function into two independent pathways: vertical dissipation through the package substrate and lateral dissipation through the heat spreader. This segmentation allows each pathway to be optimized independently, enabling the package to maintain small volume while achieving sufficient heat dissipation through the combined effect of both paths.
3Productivity
If circuit density is increased to meet functional requirements, then device functionality is enhanced, but heat generation increases worsening thermal management
Solution Approach 1:
The heat spreader introduces a lateral heat distribution dimension that complements the vertical heat flow path. This additional thermal management dimension allows higher circuit density by providing an extra pathway for heat removal, preventing thermal bottlenecks that would otherwise limit circuit density increases.
Solution Approach 2:
The heat spreader acts as an intermediary thermal management component between the heat-generating chip and the external environment. It intercepts heat from the chip, distributes it laterally across its surface area, and facilitates its removal, thereby enabling the chip to operate at higher densities without excessive temperature rise.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents chip overheating by enhancing heat dissipation in the horizontal direction, allowing for a thinner semiconductor package design while maintaining robust mechanical performance and reliability.
Implementation Method 1
a flexible graphite heat spreader with high thermal conductivity, attached to the chip and molding compound using a thermal interface material, facilitates efficient heat dissipation by providing a thermal path for heat generated by the chip to be dissipated horizontally
Data Source
AI summary
A semiconductor package is provided, which includes a first chip disposed over a first package substrate, a molding compound surrounding the first chip, a first thermal interface material disposed over the first chip and the molding compound, a heat spreader disposed over the thermal interface material, and a second thermal interface material disposed over the heat spreader. The first thermal interface material and the second thermal interface material have an identical width.