Graphite Layer on EMI Shield for Heat Dissipation

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Solution Overview

Problem

Electronic device components face challenges with heat dissipation due to electromagnetic interference (EMI) shielding, as metal shields can trap heat and potentially damage adjacent components during drops.

Innovation Solution

A graphite layer is coupled to the EMI shield, with a sheet design that includes a fold and discontinuities like holes or windows to enhance adhesion and heat transfer, allowing heat to be dissipated effectively while preventing damage from sharp edges.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a metal EMI shield is placed over a component, then electromagnetic interference is blocked, but heat dissipation ability is reduced

Engineering Contradiction:

Improveelectromagnetic interferenceVSAvoidheat dissipation

Core Design Contradiction:

Object-affected harmful factorsVSTemperature

Solution Approach 1:

The patent combines metal EMI shield material with graphite heat conducting material to create a composite structure. The metal shield provides electromagnetic interference blocking while the graphite layer provides heat dissipation pathways, resolving the contradiction between EMI protection and heat dissipation capabilities.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The graphite layer acts as an intermediary between the metal shield and the heat-generating component. It conducts heat away from the component through the shield structure, enabling heat dissipation while the metal shield maintains its EMI blocking function.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If a heat conducting sheet is placed on the EMI shield, then heat dissipation is improved, but the risk of damage from sharp edges increases

Engineering Contradiction:

Improveheat dissipationVSAvoiddamage from sharp edges

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent converts the potentially harmful sharp edges of the heat conducting sheet into a beneficial feature by creating a fold structure. The fold creates a rounded transition that eliminates sharp edges while maintaining the sheet's ability to conform to the shield surface and provide heat dissipation.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The fold structure introduces curvature to the heat conducting sheet, transforming sharp angular edges into rounded transitions. This curvature eliminates the risk of damage from sharp edges while preserving the sheet's heat conduction effectiveness.

Inventive Principle:

Principle #14Spheroidality (Curvature)

3Temperature

If a continuous sheet is used for heat dissipation, then heat transfer is efficient, but adhesion to tabs is difficult

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidadhesion to tabs

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The heat conducting sheet is segmented with discontinuities that create folds, allowing the sheet to conform to and adhere to the tabs of the EMI shield. These discontinuities enable the sheet to wrap around corners and maintain contact with tab surfaces, improving adhesion while preserving heat transfer pathways.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The graphite layer improves heat dissipation from shielded components, reduces the risk of damage from sharp edges, and provides a barrier against water and contaminants, ensuring efficient operation and protection within electronic devices.

Implementation Method 1

a sheet of heat conducting material can be placed on a top surface of the EMI shield

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

Heat generated by the component may be in part trapped by the shield. To help dissipate the generated heat, a sheet of graphite material may be coupled to the shield.

Methodology Applied

Scientific EffectHeat dissipation: Cooling

Data Source

PatentUS8879269B2Systems and method for providing a graphite layer in an electronic device

Publication Date: 2014.11.04 APPLE INC

AI summary

Systems and methods are provided for a sheet of graphite material on an electromagnetic interference shield for enhanced heat transfer. An electronic device component may be enclosed by an EMI shield, which may retain heat generated by the component. To help dissipate heat, a sheet of material selected for its heat transfer properties may be disposed over the EMI shield. A portion of the sheet may be folded over an edge of the EMI shield such that the sheet may cover a top surface of the sheet as well as tabs extending perpendicular to the top surface of the EMI shield. To facilitate the adhesion of the sheet to a smaller surface area of tabs, the sheet may include features forming a discontinuity in regions of the sheet aligned with the edge of the shield to facilitate folding the sheet. The discontinuity can include, for example, one or more holes or windows.