Graphite-Metal Submount Structure for LED Heat Dissipation

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Solution Overview

Problem

Existing submounts for light-emitting devices do not effectively dissipate heat generated by light-emitting elements, necessitating improved thermal conductivity.

Innovation Solution

A submount design featuring a support layer with a first graphite layer and multiple metal layers, where the first metal layer is thicker than the second, with uncovered regions at the outer periphery, and a method of producing this submount through layering, metal deposition, and precise cutting to enhance heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a single-layer graphite structure is used in the submount, then the manufacturing process is simple, but the heat dissipation effectiveness is insufficient

Engineering Contradiction:

Improveheat dissipation effectivenessVSAvoidlayered structure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The graphite layer is divided into multiple segments (first graphite layer and second graphite layer) separated by a metal layer. This segmentation allows each layer to contribute to heat dissipation independently while the metal layer provides thermal coupling, achieving superior heat dissipation compared to a single-layer structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The submount employs a composite structure combining graphite layers with a metal layer in between. This composite material approach leverages the high thermal conductivity of graphite in the in-plane direction and the vertical thermal coupling provided by the metal layer, creating a multi-functional thermal management system.

Inventive Principle:

Principle #40Composite materials

2Reliability

If metal layers are disposed over the entire surface of graphite layers, then electrical connectivity is maximized, but chipping and burrs occur during cutting

Engineering Contradiction:

Improvestructural integrity during cuttingVSAvoidmetal layer deposition area

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The metal layer is selectively disposed only in specific regions (first and second regions) of the graphite layer rather than covering the entire surface. This local quality approach ensures adequate electrical connectivity and mechanical support in critical areas while leaving other areas exposed to prevent chipping and burrs during cutting operations.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The metal layer is strategically positioned in advance during the manufacturing process to provide reinforcement exactly where needed for cutting operations. By pre-placing the metal layer in specific regions, the structure is prepared to resist chipping and burrs before the cutting operation occurs.

Inventive Principle:

Principle #10Preliminary action

3Reliability

If the metal layer is made uniformly thick, then manufacturing is simplified, but thermal conductivity and electrical connectivity are suboptimal

Engineering Contradiction:

Improvethermal and electrical conductivityVSAvoidmetal layer thickness control

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The metal layer exhibits non-uniform thickness with a first thickness in the first region and a second thickness in the second region. This local quality variation optimizes thermal and electrical conductivity in different areas of the submount, allowing thicker metal regions to provide enhanced connectivity where needed while thinner regions suffice for other functions.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The submount achieves enhanced heat dissipation and stability, reducing chipping and burrs, thereby improving the thermal management of light-emitting devices.

Implementation Method 1

a first graphite layer disposed on the support layer; a first metal layer disposed on the first graphite layer... a second graphite layer disposed on the support layer... a fourth metal layer disposed on the second graphite layer

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20260033050A1Submount and method of producing the same, and light-emitting device

Publication Date: 2026.01.29 NICHIA CORP

AI summary

A submount includes: a support layer; a first graphite layer disposed on the support layer; a first metal layer disposed on the first graphite layer; and a second metal layer disposed on the first metal layer. The first metal layer is thicker than the second metal layer. A first region in which the first metal layer is not disposed is provided at an outer peripheral portion of an upper surface of the first graphite layer. The second metal layer covers the first metal layer and the first region of the upper surface of the first graphite layer.