Graphite Heat-Spreader Semiconductor Package for Compact Cooling
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Solution Overview
Problem
Semiconductor packages face challenges in achieving both compactness and effective heat dissipation, particularly in application processors where heat generation occurs locally, and existing fan-in packages are limited by spatial constraints and inadequate heat dissipation capabilities.
Innovation Solution
Incorporating a heat-dissipating member made of pyrolytic graphite on the inactive surface of the semiconductor chip, which is encapsulated along with the chip, to enhance thermal conductivity and match the thermal expansion characteristics of the silicon chip, allowing for efficient heat dissipation while maintaining a compact form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a fan-in semiconductor package structure is used, then the package achieves compactness, but heat dissipation capability deteriorates due to spatial constraints
Solution Approach 1:
The patent transitions from a conventional fan-in package structure to a fan-out package structure, fundamentally changing the spatial arrangement dimension. By redistributing connection terminals outwardly from the chip region and reconfiguring the substrate layout, the package achieves improved heat dissipation pathways while maintaining compact overall dimensions, effectively solving the heat dissipation limitation of traditional fan-in designs.
Solution Approach 2:
The patent employs a composite structure combining the semiconductor chip, substrate, and heat-dissipating members with different thermal properties. This composite approach allows the package to leverage the high thermal conductivity of specific heat-dissipating materials while maintaining the electrical and mechanical functions of the chip and substrate, thereby achieving superior heat dissipation within a compact form factor.
2Ease of manufacture
If conventional heat dissipation structures are used, then manufacturing is simpler, but thermal conductivity deteriorates
Solution Approach 1:
The patent modifies the thermal parameters of the package by introducing heat-dissipating members with specifically selected thermal conductivity characteristics. These members are designed with optimal thickness, material composition, and thermal interface properties to maximize heat dissipation efficiency. The parameters are optimized to achieve high thermal conductivity while maintaining compatibility with existing manufacturing processes and cost constraints.
3Ease of manufacture
If the heat-dissipating member has different thermal expansion characteristics from the semiconductor chip, then manufacturing is easier, but reliability deteriorates due to warpage and interface peeling
Solution Approach 1:
The patent explicitly addresses thermal expansion compatibility by selecting heat-dissipating members whose coefficient of thermal expansion (CTE) closely matches that of the semiconductor chip. This CTE matching prevents differential thermal expansion during operation and manufacturing processes, thereby eliminating warpage and interface peeling issues. The patent specifies that the heat-dissipating member should have thermal expansion characteristics similar to the semiconductor chip to ensure long-term reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of pyrolytic graphite as a heat-dissipating member in the semiconductor package significantly improves thermal conductivity and reduces thermal resistance, enabling effective heat dissipation while preventing warpage and interface peeling issues, thus addressing the limitations of existing packages.
Implementation Method 1
a heat-dissipating member, which includes graphite, disposed on the inactive surface of the semiconductor chip
Implementation Method 2
having a heat-dissipating member with thermal expansion characteristics similar to those of a semiconductor chip
Data Source
AI summary
A semiconductor package includes: a semiconductor chip having an active surface, on which a connection pad is disposed, and an inactive surface opposite to the active surface; a heat-dissipating member disposed on the inactive surface of the semiconductor chip and including graphite; an encapsulant sealing at least a portion of each of the semiconductor chip and the heat-dissipating member; a capping metal layer disposed directly between the heat-dissipating member and the encapsulant; and a connection structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad, wherein the heat-dissipating member includes holes passing through at least a portion of the heat-dissipating member, and the holes overlap the inactive surface of the semiconductor chip.