Perforated Graphite Thermal Interface with Phase Change Coating
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Solution Overview
Problem
As electronic components become smaller and more densely packed, heat dissipation becomes a challenge due to irregular thermal interface surfaces leading to trapped air pockets, which reduce heat transfer efficiency.
Innovation Solution
A thermally conductive interface using a flexible, lamellar graphite sheet with coarse perforations and a thin coating of thermally conductive phase change material is interposed between the electronic component and the thermal dissipation member, enhancing heat transfer by filling surface irregularities and reducing contact resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thermal interface material is used to fill gaps and eliminate air pockets, then heat transfer efficiency is improved, but device complexity increases
Solution Approach 1:
The patent employs a composite thermal interface material consisting of a flexible graphite base layer combined with a phase change material coating. The graphite provides structural integrity and baseline thermal conductivity, while the phase change material fills surface irregularities and eliminates air pockets. This composite structure achieves superior heat transfer efficiency without excessive complexity by combining two materials with complementary properties.
Solution Approach 2:
The patent utilizes phase change material that transitions from solid to liquid at operating temperatures, dynamically adapting its physical state to optimize thermal contact. This parameter change allows the interface material to automatically conform to surface irregularities and maintain optimal thermal contact without requiring complex mechanical adjustment mechanisms.
2Area of stationary object
If the thermal interface material conforms to surface irregularities, then contact area is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs a flexible graphite sheet as the base material, which inherently can conform to irregular surfaces through elastic deformation. This flexibility allows the material to adapt to surface variations without requiring extremely flat mating surfaces, thereby reducing manufacturing precision requirements while maximizing contact area.
Solution Approach 2:
The phase change material undergoes a solid-to-liquid transition at operating temperatures, enabling it to flow into and fill surface irregularities and voids. This dynamic parameter change allows the material to automatically optimize contact area without requiring precision-machined surfaces, as the material itself adapts to the surface topology.
3Reliability
If a thin coating of phase change material is used, then heat transfer efficiency is improved, but coating application precision must be increased
Solution Approach 1:
The phase change material is formulated to undergo a solid-to-liquid transition at temperatures slightly above ambient but below component operating temperatures. This parameter change enables the coating to be applied as a thin solid layer that then melts and flows to fill voids, automatically self-regulating its thickness and distribution without requiring precision control during application.
Solution Approach 2:
The phase change material performs self-adjustment by melting and flowing into surface irregularities, then solidifying to form an optimized thermal interface. This self-service mechanism eliminates the need for precision coating application equipment or processes, as the material automatically optimizes its own distribution and thickness based on the surface topology and temperature conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved thermal conductivity and efficiency by conforming to surface irregularities, reducing contact resistance, and maintaining effective heat transfer while being easily releasable for rework or disassembly.
Implementation Method 1
a coating of a thermally-conductive phase change material on at least one of the first and second major surfaces of the graphite sheet
Implementation Method 2
a coating of a thermally-conductive phase change material on at least one of the first and second major surfaces of the graphite sheet, the coating having a thickness of less than 12.7 μm (0.5 mil)
Implementation Method 3
a heat spreading material formed of a flexible, lamellar graphite material of intercalated graphite flake in the form of a graphite sheet
Data Source
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AI summary
Thermal management materials for electronic devices used as heat transfer interfaces between, for example, the mating heat transfer surfaces of a heat- generating, electronic component, such as an integrated circuit (IC) chip, and a thermal dissipation member, such as a heat sink or spreader, for the conductive cooling of the electronic component include a heat spreading material formed of a flexible, lamellar graphite material having a plurality of coarse perforations therein; and a coating of a thermally-conductive phase change material joined to the surface of the graphite material.