Graphite Sheet Semiconductor Packaging for 3D Heat Dissipation
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Solution Overview
Problem
Semiconductor packaging structures face thermal challenges due to high heat density in 3D integration, where conventional top-side cooling is inefficient, and additional thermal resistance is present in backside power distribution networks.
Innovation Solution
Incorporating a thermal graphite sheet within the laminate or frontside build-up layers of the organic substrate core, which serves as a thermal conduction path to efficiently transfer heat from semiconductor chips to a heat spreader, while minimizing coefficient of thermal expansion (CTE) mismatch and warpage through the use of CTE-controlled electrically conductive layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional top-side cooling is used in semiconductor packaging, then the packaging structure is simple, but heat dissipation efficiency is insufficient due to high heat density in 3D integration
Solution Approach 1:
The patent transitions from conventional top-side cooling to backside cooling by adding a thermal conduction path through the substrate. This dimensional change allows heat to be extracted from the backside of the semiconductor device, effectively doubling the thermal management capability and addressing the heat dissipation inefficiency without simply increasing top-side cooling complexity.
Solution Approach 2:
The patent employs composite materials including graphite sheets with high thermal conductivity integrated into the substrate structure. This composite approach combines materials with different thermal properties to create an efficient thermal conduction path that enhances heat dissipation while maintaining structural integrity, resolving the contradiction between simple structure and effective cooling.
2Temperature
If additional thermal conduction paths are added to improve heat dissipation, then heat dissipation efficiency improves, but manufacturing complexity increases
Solution Approach 1:
The patent merges the thermal conduction path with the existing substrate structure by integrating graphite sheets during the substrate manufacturing process. This consolidation approach combines multiple functions (structural support and thermal conduction) into a single integrated component, improving heat dissipation while avoiding the need for separate assembly steps that would increase manufacturing complexity.
3Stability of the object's composition
If CTE-controlled electrically conductive layers are used to minimize warpage, then structural stability improves, but device complexity increases
Solution Approach 1:
The patent addresses warpage by carefully selecting and controlling the coefficient of thermal expansion (CTE) parameters of the electrically conductive layers. By matching CTE values between different layers, the patent minimizes thermal stress and warpage during temperature cycling, thereby improving structural stability without requiring complex additional components or structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively addresses thermal challenges by enhancing heat dissipation, reducing stress and warpage, and improving the thermal management of semiconductor packaging structures, particularly in 3D integration and backside power distribution networks.
Implementation Method 1
The graphite sheet serves as a thermal conduction path which can effectively conduct heat generated by semiconductor chips into a foot of a heat spreader
Implementation Method 2
By sandwiching the graphite sheet between two electrically conductive layers, coefficient of thermal expansion (CTE) mismatch within the laminate or frontside build-up layers can be minimized
Data Source
AI summary
Semiconductor packaging structures are provided in which a graphite sheet is used for thermal conduction of heat generated by a semiconductor chip to a foot of a heat spreader that is thermally connected to the graphite sheet. The graphite sheet can be present in a frontside laminate or in an upper portion of frontside build-up layers of an organic substrate core.