Graphite-Silicon Laminated Assembly for Direct Heat Dissipation
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Solution Overview
Problem
Existing laminated assemblies comprising a graphite thin film and a silicon substrate often rely on intermediate layers or adhesives, which hinder effective heat transfer from the silicon substrate to the graphite thin film, limiting their application in enhanced heat discharge type electronic devices.
Innovation Solution
A laminated assembly is achieved by directly bonding a smoothed graphite thin film onto a silicon substrate without any intermediate layer or adhesive, utilizing surface activation through cleaning under deaeration conditions to facilitate spontaneous bonding via Van der Waals forces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an intermediate layer or adhesive is used to bond graphite thin film to silicon substrate, then bonding strength is improved, but heat conduction is hindered
Solution Approach 1:
The patent removes the intermediate layer or adhesive from the bonding interface between graphite thin film and silicon substrate. By extracting this harmful element, the patent achieves direct contact bonding that maintains both bonding strength and superior heat conduction properties, eliminating the thermal barrier effect caused by intermediate materials.
Solution Approach 2:
The patent introduces a plasma treatment as an intermediary process to activate the bonding surfaces of graphite and silicon. This plasma activation creates surface groups that enhance direct bonding without requiring physical intermediate layers, thus maintaining thermal contact while achieving sufficient bonding strength.
2Ease of manufacture
If conventional bonding methods with intermediate layers are used, then manufacturing process is simplified, but heat discharge efficiency deteriorates
Solution Approach 1:
The patent changes the bonding parameters by using plasma treatment at relatively low temperatures (room temperature to 200°C) instead of high-temperature bonding processes. This parameter change enables direct bonding without intermediate layers while maintaining manufacturing feasibility, thus achieving both ease of manufacture and superior heat discharge efficiency.
3Reliability
If direct bonding without intermediate layer is implemented, then heat conduction is improved, but bonding difficulty increases
Solution Approach 1:
The patent applies plasma treatment as a preliminary action to activate the bonding surfaces of graphite and silicon before direct contact. This preliminary surface activation creates reactive groups that facilitate spontaneous bonding upon contact, reducing bonding difficulty while maintaining direct contact for superior heat conduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This direct lamination approach enhances heat conduction properties, allowing for more efficient heat discharge in electronic devices, as demonstrated by increased thermal diffusivity and effective heat dissipation characteristics.
Implementation Method 1
a graphite thin film that is an enhanced heat conduction member
Implementation Method 2
spontaneous bonding via Van der Waals forces
Data Source
AI summary
The invention provides a laminated assembly dedicated to an enhanced heat discharge type electronic device application by providing an enhanced thermal performance to a silicon device. A graphite thin film/silicon substrate laminated assembly is provided by cleaning the surfaces of a smoothed graphite thin film and a silicon substrate under deaeration conditions for activation, thereby bringing them close to each other for spontaneous bonding. In such a laminated assembly wherein the graphite thin film is provided on the silicon substrate, the silicon substrate and graphite thin film come into contact directly via an interface.