Graphite Substrate Multi-Chip Module With Integrated Ink Channels
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Solution Overview
Problem
Existing multi-chip module assemblies for thermal ink printing are complex, costly, and inefficient due to the use of expensive ceramic substrates and complex bus lines, as well as expensive electrophoretic deposition processes.
Innovation Solution
A multi-chip module assembly using a graphite substrate with integrated ink channels and a Printed Wiring Board (PWB) attached via a pre-impregnated composite fiber adhesive layer, eliminating the need for molded parts and providing a robust, easy-to-manufacture solution with hermetic sealing and improved reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a ceramic substrate is used to withstand elevated temperatures, then temperature resistance is improved, but manufacturing cost and complexity increase due to specific molds and hard-tooling equipment
Solution Approach 1:
The patent replaces expensive ceramic substrates with aluminum substrates that are cheaper and easier to manufacture. The aluminum substrate serves the same functional purpose of withstanding temperatures during the printing process, eliminating the need for costly ceramic materials and specialized molding equipment.
Solution Approach 2:
The patent changes the material parameter from ceramic to aluminum, which has sufficient temperature resistance for the application. This parameter change maintains the thermal performance requirements while dramatically reducing manufacturing complexity and cost.
2Reliability
If complex bus lines and IC packages are used, then electrical connection reliability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent extracts and eliminates the complex IC packages and bus lines from the system. Instead, it uses a simplified direct electrical connection system where the print head elements are electrically connected to the substrate through simple conductive structures, maintaining reliability while reducing complexity.
Solution Approach 2:
Rather than using complex IC packages to achieve electrical connections, the patent inverts the approach by integrating simple conductive traces directly into the substrate structure, achieving the same electrical connection function with much lower complexity.
3Manufacturing precision
If electrophoretic deposition process is used for coating, then coating quality is improved, but manufacturing cost and process complexity increase
Solution Approach 1:
The patent replaces the expensive electrophoretic deposition process with a simpler, cheaper coating method. The coating is applied using standard manufacturing techniques that are already widely available, eliminating the need for specialized electrophoretic deposition equipment while maintaining adequate coating quality.
Solution Approach 2:
The coating process is simplified to use self-service methods that are already integrated into standard manufacturing workflows, eliminating the need for separate, expensive electrophoretic deposition lines.
4Stability of the object's composition
If molded ink ports are used, then ink channel integration is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the ink channels directly into the substrate structure itself, eliminating the need for separate molded ink port components. The substrate serves dual functions as both the structural base and the ink delivery system, reducing overall part count and manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution simplifies manufacturing, reduces costs, and enhances reliability by using a graphite substrate with embedded ink channels and a PWB, ensuring stable electrical connections and efficient ink delivery without the need for complex moldings or expensive equipment.
Implementation Method 1
a first intermediate adhesive layer of a pre-impregnated composite fiber arranged between the graphite cover plate and the graphite substrate
Implementation Method 2
one or more ink feeding slots passing through the graphite substrate and being in fluidic communication with the respective one or more ink channels
Data Source
AI summary
A multi-chip module (MCM) assembly comprising: a graphite substrate having a front surface and a back surface and comprising a plurality of silicon chips mounted on the front surface, a Printed Wiring Board (PWB) attached to the graphite substrate and provided with openings surrounding outer profiles of the silicon chips, the graphite substrate comprises one or more ink channels on the back surface and one or more ink feeding slots passing through the graphite substrate and being in fluidic communication with the respective one or more ink channels, so that each of the silicon chips can be fed with one or more different types of inks, the MCM assembly further comprises a graphite cover plate configured to cover the one or more ink channels of the graphite substrate.