Graphite Heat Diffusion Structure for Low-Resistance Thermal Paths

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Solution Overview

Problem

Existing heat dissipation structures in miniaturized electronic devices face challenges with high thermal resistance and thickness issues due to the use of nano TIM, leading to inefficient heat dissipation and potential performance degradation.

Innovation Solution

A heat dissipation structure that directly contacts a heat transfer member (CF TIM) with a heat diffusing material (graphite) and includes a compressible heat diffusion structure to improve elasticity and reduce thickness, providing efficient heat transfer and shielding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If nano TIM is used in heat dissipation structure, then EMI shielding and insulation are improved, but thermal resistance increases and heat dissipation performance deteriorates

Engineering Contradiction:

ImproveEMI shieldingVSAvoidheat dissipation performance

Core Design Contradiction:

Object-affected harmful factorsVSReliability

Solution Approach 1:

The patent removes nano TIM from the heat dissipation structure entirely, extracting the problematic component that caused high thermal resistance. Instead, it uses a heat diffusion structure with openings that directly contacts the heat transfer member, eliminating the thermal barrier while maintaining EMI shielding through the shield can design.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The shield can is designed with localized openings in specific areas corresponding to electronic elements, allowing heat to pass through while maintaining EMI shielding in other areas. This creates different functional zones: open areas for heat dissipation and shielded areas for EMI protection.

Inventive Principle:

Principle #3Local quality

2Length of moving object

If heat dissipation structure thickness is reduced for miniaturization, then device portability is improved, but heat dissipation efficiency decreases

Engineering Contradiction:

Improvedevice thicknessVSAvoidheat dissipation efficiency

Core Design Contradiction:

Length of moving objectVSReliability

Solution Approach 1:

The heat diffusion structure extends heat dissipation into the lateral dimension through its planar configuration with openings, rather than relying solely on vertical thickness. This allows efficient heat dissipation in a thin profile by utilizing surface area and direct contact pathways.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The heat diffusion structure features asymmetric opening patterns positioned specifically over heat-generating electronic elements, creating optimized heat dissipation pathways where needed while maintaining structural integrity and thin overall profile.

Inventive Principle:

Principle #4Asymmetry

3Strength

If heat diffusion structure provides elasticity for impact protection, then structural flexibility is improved, but device thickness increases

Engineering Contradiction:

Improveimpact resistanceVSAvoidheat dissipation structure thickness

Core Design Contradiction:

StrengthVSLength of moving object

Solution Approach 1:

The heat diffusion structure incorporates flexible, thin-film characteristics that allow it to deform elastically under impact while maintaining its primary heat dissipation function. The structure's geometry and material properties enable flexibility without requiring significant thickness.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances heat dissipation performance, reduces thickness, and provides effective EMI shielding while maintaining structural integrity and flexibility against external impacts.

Implementation Method 1

a heat transfer member comprising a thermally conductive material disposed between and in contact with the electronic element and the heat diffusion structure

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a heat diffusion structure comprising a heat diffusing material disposed on at least a part of the shield can

Methodology Applied

Scientific EffectThermal diffusion: Diffusion

Data Source

PatentUS12453058B2Heat dissipation structure and electronic device including same

Publication Date: 2025.10.21 SAMSUNG ELECTRONICS CO LTD

AI summary

An electronic device according to various embodiments of the present disclosure may comprise: a circuit board; at least one electronic component disposed on one surface of the circuit board; a shield can mounted to the one surface of the circuit board and accommodating the electronic component therein and includes at least one opening formed in the area corresponding to the electric component; a heat-dissipating structure disposed in at least a part of the shield can to close at least a part of the at least one opening; and a heat transfer member disposed between and in contact with the electronic component and the heat-dissipating structure and at least a part of which is disposed in the at least one opening.