Graphite Heat Spreader With Metal-Coated Through Holes
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Solution Overview
Problem
Conventional heat dissipation methods in semiconductor and electronic devices face issues with thermal conductivity limitations, layer peeling due to thermal expansion differences, and reliability concerns, especially when dealing with high heat generation and cycling.
Innovation Solution
A graphite structure with parallel basal planes, through holes, and a metal coating layer that forms compounds with carbon atoms, enhancing thermal conductivity and adhesion to reduce peeling and stress-related failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If nanocarbon layer and amorphous silicon layer are used for heat dissipation, then thermal conductivity is improved, but layer peeling occurs due to thermal expansion difference
Solution Approach 1:
The invention uses a composite structure consisting of nanocarbon layer, amorphous silicon layer, and metal interlayer. This multi-material composite approach allows each layer to contribute its unique properties: nanocarbon for high in-plane thermal conductivity, amorphous silicon for structural stability, and metal interlayer for stress buffering and enhanced adhesion, thereby preventing peeling while maintaining heat dissipation performance
Solution Approach 2:
The metal interlayer acts as an intermediary between the nanocarbon layer and amorphous silicon layer. It buffers the thermal expansion stress difference between these two layers during heating and cooling cycles, preventing stress concentration at the interfaces that would otherwise cause peeling or cracking
2Device complexity
If thin-film process is used to manufacture nanocarbon and amorphous silicon layers, then device integration is achieved, but manufacturing time increases
Solution Approach 1:
The manufacturing process is segmented into distinct steps: forming nanocarbon layer first, then amorphous silicon layer, and finally metal interlayer. This segmentation allows each layer to be optimized independently and manufactured using appropriate processes, reducing overall manufacturing time while maintaining structural integrity
3Strength
If graphite plate with through holes and metal coating is used, then adhesion strength is improved, but device size increases
Solution Approach 1:
The graphite plate incorporates through holes creating a porous structure that reduces material volume and device size. The metal coating on the inner surfaces of these holes provides adhesion strength and stress buffering, compensating for the reduced material volume while maintaining structural integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The graphite structure effectively diffuses heat, maintains high reliability by preventing peeling and stress-induced failures, allowing for smaller, lighter, and more efficient heat management in electronic devices.
Implementation Method 1
a coating layer containing a metal covering the inner surfaces of the through holes, the metal forming a compound with the carbon atoms of the graphite plate
Implementation Method 2
the first layer has thermal conductivity of about 950 W/mk to 1600 W/mk in an in-plane direction, efficiently propagating and diffusing heat from a heated portion in the in-plane direction
Implementation Method 3
continuous holes formed inside the through holes with the coating layer covering the inner surfaces of the through holes, the continuous holes connecting the front side and the back side of the graphite plate
Data Source
AI summary
A graphite structure includes a graphite plate (1) that is made of a highly heat conductive material and has a thickness of 15 μm or less. A Ti layer (3) having a thickness of 10 nm to 200 nm covers the inner surfaces of through holes (2) penetrating the laminate of the graphite plate (1) from the front side to the back side of the laminate. Furthermore, continuous holes (4) are formed inside the through holes (2). This configuration can achieve a smaller thickness and high reliability while keeping high thermal conductivity of graphite.