Graphite Vapor Chamber Structure for Thin Electronic Cooling
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Solution Overview
Problem
Existing heat pipes and vapor chambers used for heat dissipation in electronic devices are thick, complicating the realization of lightweight and thin designs due to the need for internal cavities and complex manufacturing processes, which also increase costs.
Innovation Solution
A vapor chamber constructed from stacked graphite sheets with connection layers, such as adhesive or metal bonding layers, providing high thermal conductivity without internal cavities, allowing for a thinner design while maintaining heat dissipation performance comparable to traditional heat pipes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat pipe with internal cavity for liquid medium is used for heat dissipation, then heat dissipation function is achieved, but thickness of the device increases
Solution Approach 1:
The patent extracts the liquid medium and internal cavity structure from the heat pipe design. Instead of using a traditional heat pipe with internal cavity for liquid circulation, the invention uses a solid graphite vapor chamber that directly contacts the heating element, eliminating the need for internal cavity and liquid medium while maintaining heat dissipation function.
Solution Approach 2:
The patent replaces the mechanical liquid circulation system (pump, pipes, phase change mechanism) with a solid graphite material that conducts heat through thermal conduction. The graphite vapor chamber directly conducts heat from the heating element to the surrounding environment, substituting the complex mechanical heat pipe system with a simpler solid-state thermal conduction system.
2Temperature
If a heat pipe with internal cavity structure is used, then heat dissipation is achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent removes the internal cavity structure and liquid medium from the heat dissipation system, replacing them with a solid graphite vapor chamber. This extraction eliminates the complexity of internal passages, seals, and liquid circulation mechanisms while maintaining effective heat dissipation through the high thermal conductivity of graphite.
Solution Approach 2:
The patent changes the physical state parameter from liquid medium in a cavity to solid graphite material. This parameter change simplifies the structure by eliminating the need for enclosed cavities and liquid containment, while the high thermal conductivity of graphite maintains the heat dissipation performance.
3Temperature
If traditional heat pipe with cavity is used, then heat dissipation function is provided, but weight of the device increases
Solution Approach 1:
The patent replaces the mechanical liquid circulation system with a solid graphite vapor chamber that relies on thermal conduction. This substitution eliminates the weight of liquid medium and the structural requirements for containing and circulating it, while graphite's high strength-to-weight ratio provides effective heat dissipation with reduced overall weight.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The vapor chamber achieves effective heat dissipation with a reduced thickness, facilitating lighter and thinner electronic devices and lowering manufacturing costs compared to conventional solutions.
Implementation Method 1
a thermal conductivity coefficient of the material of the vapor chamber is high, so that the vapor chamber has a good heat conduction performance
Implementation Method 2
the connection layer is an adhesive layer, where two adjacent graphite sheets are bonded by the adhesive layer
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
Embodiments of this application provide a vapor chamber (53) and an electronic device (100), which are intended to resolve the problem in the related art that it is difficult to realize a light and thin electronic device due to a relatively great thickness of a heat pipe for heat dissipation. The vapor chamber (53) provided in the embodiments is formed by arranging, in a stacked manner, a plurality of graphite sheets (530) made of graphite or graphene; a thermal conductivity coefficient of the material of the vapor chamber (53) is high, so that the vapor chamber (53) has a good heat conduction performance; because there is no need to define a cavity inside the vapor chamber (53), the vapor chamber (53) can have a relatively small thickness value; and under the premise that the heat dissipation performance of the vapor chamber (53) is basically the same as the heat dissipation performance of a heat pipe, the thickness of the vapor chamber (53) can be less than the thickness of the heat pipe. In this way, when a vapor chamber (53) is used to replace a heat pipe to assist an electronic component of an electronic device (100) in dissipating heat, the thickness of the electronic device (100) can also be correspondingly reduced, thereby facilitating the realization of a light and thin electronic device (100).