Thermally Conductive Graphitic Carbon Composite Enclosure
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Solution Overview
Problem
Existing composite materials for electronic device enclosures face challenges with weight, strength, and thermal conductivity, as they either add significant weight with metallic components or lose strength at elevated temperatures, leading to thermal stress cracking and brittleness.
Innovation Solution
A heat dissipative composite material is developed using a carbon fiber lay-up with a pyrolizable resin that is pyrolized to form a graphitic carbon laminate structure, infused with a structural resin to enhance strength and maintain high thermal conductivity, achieving a z-axis thermal conductivity of at least 10 W/mK.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If metal boxes are used for electronic device enclosures, then thermal conductivity and strength requirements are satisfied, but weight increases significantly
Solution Approach 1:
The patent uses carbon fiber reinforced plastic composite materials combined with phase change material microcapsules to create an enclosure that achieves both lightweight properties and effective thermal management, replacing traditional metal boxes while maintaining thermal conductivity requirements
Solution Approach 2:
Phase change material microcapsules act as an intermediary substance embedded within the carbon fiber composite structure, facilitating heat absorption and dissipation without requiring the entire enclosure to be made of thermally conductive metal, thus reducing weight while maintaining thermal performance
2Weight of moving object
If carbon composite materials are used to reduce weight, then weight decreases and strength increases, but thermal conductivity decreases
Solution Approach 1:
The patent creates a hybrid composite material system combining carbon fiber reinforcement with phase change material microcapsules, where the carbon fiber provides structural strength and the phase change materials provide thermal management functionality, achieving both lightweight and thermally conductive properties
Solution Approach 2:
The phase change material microcapsules are distributed locally within the carbon fiber composite structure at strategic locations where heat generation occurs, providing targeted thermal management without compromising the overall lightweight and strong structure
3Temperature
If carbon composite materials are used for high thermal conductivity, then thermal conductivity increases, but strength is lost in elevated temperature environments
Solution Approach 1:
The carbon fiber matrix serves as an intermediary structural framework that maintains mechanical strength at elevated temperatures, while the embedded phase change material microcapsules handle thermal conductivity and heat dissipation, separating the structural and thermal management functions
Solution Approach 2:
The patent utilizes the phase change property of the embedded microcapsule materials, which change physical state (solid-liquid transition) at specific temperatures to absorb excess heat, thereby maintaining structural integrity and strength of the carbon fiber composite even in elevated temperature environments
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite material achieves low weight, high strength, and high thermal conductivity without contributing to thermal ablation, making it suitable for electronic device enclosures while reducing weight and enhancing heat dissipation.
Implementation Method 1
The pyrolizable resin can be pyrolized in the carbon fiber lay up to a graphitic carbon state to form a graphitic carbon laminate structure with the carbon fiber
Implementation Method 2
These thermally conductive enclosures allow the heat from the electronic device to dissipate by conduction
Data Source
AI summary
A heat dissipative composite material including a carbon fiber lay-up having a resin pyrolized to form a graphitic carbon laminate structure. A structural resin fills voids in the graphitic carbon laminate structure and provides strength to the graphitic carbon laminate structure.