Grating-Based Bonding Alignment for Sub-Micron 3D Chip Integration
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Solution Overview
Problem
The challenge in semiconductor manufacturing lies in achieving precise bonding accuracy for three-dimensional chip integration, as existing bonding technologies struggle to align and bond semiconductor materials effectively, impacting the performance and integration of semiconductor devices.
Innovation Solution
A bonding apparatus and method that utilizes a grating assembly to determine displacement information and coordinate alignment of components, employing a calibrated coordinate system and image acquisition members to read alignment marks, enabling precise positioning and bonding of semiconductor wafers or chips with sub-micron accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional bonding technologies are used for three-dimensional chip integration, then the bonding process can be performed, but bonding accuracy is insufficient and cannot achieve sub-micron alignment precision
Solution Approach 1:
The patent replaces conventional mechanical positioning systems with an optical measurement system. A grating assembly with grating scales and optical detectors is used to establish a precise coordinate system, enabling sub-micron alignment accuracy through optical interference and detection methods rather than mechanical means.
Solution Approach 2:
The patent uses alignment marks patterned on the semiconductor wafers as reference copies for positioning. These marks are detected by the optical system to establish coordinate transformations between different wafer surfaces, enabling precise relative positioning without direct mechanical contact.
2Measurement precision
If high bonding accuracy is achieved through conventional methods, then alignment precision may be improved, but the complexity of the bonding system increases significantly
Solution Approach 1:
The grating assembly serves multiple functions: it establishes the coordinate system, measures positions of alignment marks, and provides reference frames for coordinate transformation. This multi-functional design achieves high measurement precision without requiring separate complex subsystems for each function.
Solution Approach 2:
The patent introduces alignment marks as intermediary reference elements on the wafer surfaces. These marks mediate between the optical detection system and the physical positions to be measured, simplifying the measurement process and reducing system complexity while maintaining high precision.
3Manufacturing precision
If precise coordinate alignment is implemented for sub-micron bonding accuracy, then bonding quality improves, but the measurement and detection difficulty increases
Solution Approach 1:
The patent performs preliminary actions by pre-establishing coordinate systems on each wafer through detection of alignment marks before the actual bonding process. This preliminary coordinate establishment simplifies the subsequent bonding operation, as the precise positioning framework is already in place.
Solution Approach 2:
The patent replaces difficult direct mechanical measurement of wafer positions with optical detection of alignment marks. The grating assembly with optical detectors measures positions through light interference patterns, making the measurement process easier and more precise than conventional mechanical methods.
Data Source
AI summary
A bonding apparatus and a bonding method are provided. The bonding apparatus includes: a machine base, including a movable pick-up platform; and a grating assembly, configured to determine displacement information of the movable pick-up platform along a first direction and displacement information of the movable pick-up platform along a second direction. Based on the displacement information along the first direction and the displacement information along the second direction, the grating assembly is further configured to determine coordinate information of the movable pick-up platform.