Grating-Coupled Photonic Die With Optical Nanostructures
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Solution Overview
Problem
Integration of multiple semiconductor devices into a single semiconductor wafer poses a challenge in the field of semiconductor manufacturing, particularly in achieving efficient wafer-level packaging and optical transformation of incident radiation.
Innovation Solution
The manufacturing process involves forming optical nanostructures in an optically active area of an optical die, which is then integrated with a photonic die and semiconductor dies to perform optical transformations on incident radiation before it reaches the grating coupler.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple semiconductor devices are integrated into a single wafer, then manufacturing efficiency and productivity improve, but device complexity and alignment precision requirements increase
Solution Approach 1:
The patent divides the semiconductor wafer into multiple device unit regions, each containing grating couplers, optical devices, and interconnection structures. This segmentation allows independent processing and testing of individual devices while maintaining wafer-level integration benefits, thereby improving manufacturing efficiency without overwhelming complexity
Solution Approach 2:
The patent implements a hierarchical structure where device unit regions are nested within the wafer, interconnection structures are nested within dielectric layers, and optical components are nested within specific device regions. This nested organization manages complexity by creating manageable layers of integration
2Adaptability or versatility
If multiple optical components are stacked to achieve optical transformation, then functional versatility improves, but alignment precision and manufacturing complexity increase
Solution Approach 1:
The patent extracts the optical transformation function from separate stacked components and integrates it directly into the grating coupler structure itself. By taking out the need for multiple discrete optical components and embedding the transformation capability within the coupler, alignment precision requirements are significantly reduced while maintaining optical functionality
Solution Approach 2:
The patent merges the grating coupler and optical transformation functions into a single integrated structure. Instead of stacking separate optical components, the transformation capability is combined with the coupler, reducing the number of components and simplifying alignment requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the integration of optical functions, reduces the overall thickness of semiconductor devices, and avoids alignment issues associated with stacking multiple optical components, thereby enhancing manufacturing efficiency and product yield.
Implementation Method 1
optical nanostructures overlie the grating coupler so that incident radiation of a predetermined wavelength crosses the optically active area before reaching the grating coupler
Implementation Method 2
positions and shapes of the optical nanostructures are such to perform an optical transformation on the incident radiation
Data Source
AI summary
A semiconductor device includes a photonic die and an optical die. The photonic die includes a grating coupler and an optical device. The optical device is connected to the grating coupler to receive radiation of predetermined wavelength incident on the grating coupler. The optical die is disposed over the photonic die and includes a substrate with optical nanostructures. Positions and shapes of the optical nanostructures are such to perform an optical transformation on the incident radiation of predetermined wavelength when the incident radiation passes through an area of the substrate where the optical nanostructures are located. The optical nanostructures overlie the grating coupler so that the incident radiation of predetermined wavelength crosses the optical die where the optical nanostructures are located before reaching the grating coupler.