Gravity Guide for Electronic Component Transport
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Solution Overview
Problem
Existing methods for handling singulated electronic components on interdigitated lead frames are time-consuming and prone to component damage due to incorrect placement and the use of kickers or pushers, which can cause collisions and lead to defects during transport.
Innovation Solution
A guide system with alternating lanes at different levels for receiving and transporting components from a singulation device, allowing direct ejection and transport without pick and place mechanisms, using a downward incline to utilize gravity and prevent damage, and subsequent pitch and levelling adjustments to ensure proper alignment and spacing for smooth transfer to an output area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a pick and place process is used to transport singulated units to the pitch adjustment means, then the components can be precisely positioned, but the process becomes time-consuming and reduces productivity
Solution Approach 1:
The patent extracts the pitch adjustment function from the traditional pick-and-place process. By providing pitch adjustment means that can directly adjust the pitch of components during transport on the guide, the system eliminates the need for precise pick-and-place positioning while maintaining component placement accuracy, thereby significantly improving processing speed and productivity
2Device complexity
If components are placed on the rail of a guide incorrectly, then the transport process becomes simpler, but components can be damaged during transport
Solution Approach 1:
The patent applies preliminary action by providing pitch adjustment means that adjust the pitch of components before they are transported along the guide. This preliminary pitch adjustment ensures that components are properly spaced and positioned prior to transport, preventing damage during the transport process while maintaining a simple guide rail system
3Device complexity
If a kicker or pusher is used to move components along the guide, then the transport mechanism becomes simpler, but components can be damaged causing defects
Solution Approach 1:
The patent extracts the component propulsion function from the kicker/pusher mechanism. By using a gravity-based guide system where components are transported along an inclined guide rail without active pushing or kicking, the system eliminates mechanical contact that could damage components, thereby maintaining simple transport mechanism complexity while significantly improving component quality and reliability
4Area of stationary object
If components are transported side-by-side along a guide in close proximity, then the space utilization improves, but collisions between leads of adjacent components can occur causing damage or derailment
Solution Approach 1:
The patent applies dimensionality change by utilizing the vertical dimension through an inclined guide rail design. Components are transported along an inclined plane rather than horizontally side-by-side, which naturally increases the vertical spacing between adjacent components and prevents lead collisions while maintaining efficient space utilization in the horizontal plane
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables high-speed, damage-free transport and alignment of electronic components, reducing the risk of collisions and increasing output efficiency by eliminating the need for error-prone handling methods and ensuring components are properly spaced and aligned for downstream processing.
Implementation Method 1
using a downward incline to utilize gravity and prevent damage
Data Source
AI summary
An apparatus for handling electronic components on a lead frame. The apparatus including a singulation device configured to singulate the lead frame to thereby separate the electronic components and to position the separated electronic components alternately into at least two layers along different levels; and a guide having a plurality of lanes running along a surface of the guide, the lanes being configured to transport the separated electronic components from a first end of the guide arranged adjacent to the singulation device to a second end of the guide arranged adjacent to an output area. The lanes at the first end of the guide are alternately arranged into at least two layers having respective levels to receive the electronic components from the singulation device, whereas the lanes at the second end of the guide are arranged into a single layer along a common level for transferring the electronic components to the output area.