Gravity Heat Dissipation Device for Vertical Graphics Cards
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Solution Overview
Problem
There is a need to balance the heat dissipation performance of vertically mounted graphics cards and horizontally mounted graphics cards to improve overall electronic device efficiency, as the increasing heat generation in compact electronic devices poses challenges for effective cooling.
Innovation Solution
A gravity heat dissipation device is designed, comprising a fixing frame, a heat conduction block, and multiple heat pipes arranged in a specific configuration to enhance heat absorption and dissipation. The heat pipes include heat absorption, connection, and dissipation portions, with the second and third heat pipes connected symmetrically to the first heat pipe, and additional heat pipes further enhancing the heat dissipation network.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If vertically mounted graphics cards are adopted to improve space utilization, then space utilization is improved, but heat dissipation performance deteriorates
Solution Approach 1:
The heat dissipation system is segmented into multiple heat pipes (first heat pipe, second heat pipe, third heat pipe) with distinct functions and orientations. The first heat pipe handles primary heat transfer vertically, while the second and third heat pipes handle heat transfer in different directions, segmenting the heat dissipation path to effectively manage heat in compact vertical configurations
Solution Approach 2:
The patent transitions from traditional horizontal heat dissipation to multi-dimensional heat transfer by positioning heat pipes in different spatial orientations. The second heat pipe is positioned at a first angle to the first heat pipe, and the third heat pipe is positioned at a second angle, creating three-dimensional heat dissipation pathways that maintain effectiveness in vertically mounted configurations
2Power
If the number of cores of the computing chip is increased to improve calculating power, then calculating power is improved, but heat generation increases
Solution Approach 1:
Multiple heat pipes (first, second, and third heat pipes) are combined into a unified heat dissipation system that works协同 to manage heat from high-power computing chips. The heat pipes are connected to the same heat source and work together to distribute and dissipate heat, providing enhanced cooling capacity for multi-core processors
Solution Approach 2:
The heat pipes serve as intermediary components between the heat-generating computing chip and the heat dissipation fins. They transfer heat from the chip through phase change and capillary action, mediating the heat transfer process efficiently to manage the increased heat generation from high-core-count processors
3Device complexity
If traditional heat dissipation configurations are used to maintain simplicity, then device complexity is reduced, but heat dissipation efficiency deteriorates
Solution Approach 1:
The heat dissipation system employs dynamic phase change processes within the heat pipes, where working fluid continuously cycles between liquid and vapor phases to actively transport heat. This dynamic mechanism adapts to varying heat loads and maintains efficient heat transfer without complex external control systems
Solution Approach 2:
The heat pipes are designed with self-contained capillary structures that automatically drive the working fluid circulation without external pumps or motors. The capillary wicking material self-generates the force needed to return condensed liquid to the evaporation section, making the heat dissipation system self-servicing and maintaining simplicity while improving efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The gravity heat dissipation device effectively improves the heat dissipation efficiency for vertically mounted graphics cards, reduces the operating temperature of computing chips, and enhances the overall working efficiency of electronic devices by leveraging gravity and capillary forces within the heat pipes.
Implementation Method 1
the connection portion of the first heat pipe is located below the heat absorption portion of the first heat pipe and the heat dissipation portion of the first heat pipe
Implementation Method 2
gravity heat dissipation device
Implementation Method 3
The heat conduction block is installed in the fixing frame to contact a heat source
Data Source
AI summary
A gravity heat dissipation device includes a fixed frame, a heat conduction block, a first heat pipe and a second heat pipe. The heat conduction block is installed in the fixed frame and used to contact a heat source. The first heat pipe is connected to the heat conduction block, and a connection portion of the first heat pipe is located below a heat absorption portion of the first heat pipe and a heat dissipation portion of the first heat pipe. The second heat pipe is connected to the heat conduction block and the first heat pipe, and a first connection portion is located above a heat absorption portion of the second heat pipe and a first heat dissipation portion of the second heat pipe.