Gravity Heat Pipe Server Cooling for High-Density Chip Heat
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High power density heat dissipation and heat transfer in high-performance computing chips in data centers, leading to high PUE index and electricity costs, are not effectively addressed by existing technologies.
Innovation Solution
A server heat dissipation system utilizing a gravity heat pipe with an evaporator in thermal contact with the chip, a condenser above the server, and an insulated pipe connecting them, where a working substance undergoes liquid-to-gaseous state transitions to transfer heat without electricity, using deionized water, liquid ammonia, or chlorofluorocarbons, and incorporating a condenser heat exchanger and refrigeration device for additional cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional active cooling systems are used for high-performance computing chips, then heat dissipation effectiveness is improved, but energy consumption and PUE index increase
Solution Approach 1:
The heat dissipation system uses the heat itself to drive the working substance through phase change and gravity-driven circulation, eliminating the need for external power sources. The thermal energy from the chip directly powers the heat transfer cycle through evaporation and condensation processes
Solution Approach 2:
The system utilizes phase transitions of the working substance (liquid to gas in evaporator, gas to liquid in condenser) to transfer heat efficiently. This phase change mechanism enables high heat transfer coefficients without requiring additional energy input for pumping or forcing fluid circulation
2Productivity
If high power density computing chips are deployed to increase computing capacity, then productivity is improved, but heat dissipation difficulty and energy consumption increase
Solution Approach 1:
The gravity heat pipe exploits phase transitions to achieve efficient heat transfer from high-power density chips. The working substance evaporates at the evaporator section near the heat source and condenses at the condenser section, transferring large amounts of heat energy without requiring active pumping
Solution Approach 2:
The system replaces mechanical pumping systems with gravity-driven natural circulation. The phase change process creates density differences that drive the working substance circulation, eliminating the need for mechanical pumps and associated energy consumption
3Temperature
If active cooling systems with pumps and fans are used, then heat transfer efficiency is improved, but device complexity and maintenance requirements increase
Solution Approach 1:
The gravity heat pipe system is self-regulating and requires no external control systems. The phase change process automatically adjusts to heat load variations, and gravity ensures continuous circulation without mechanical actuators or control electronics
Solution Approach 2:
The design extracts and eliminates complex mechanical components (pumps, fans, valves, control systems) from the heat dissipation system, retaining only the essential phase change and gravity-driven circulation mechanisms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively dissipates chip heat while reducing the PUE index and electricity consumption by leveraging gravity-driven heat transfer, utilizing passive cooling methods, and integrating condenser heat exchangers and refrigeration for enhanced cooling capacity.
Implementation Method 1
the working substance absorbs heat and is converted into gaseous state
Implementation Method 2
conversion cycles between liquid state and gaseous state by retracting and releasing heat
Implementation Method 3
the heat of the working substance is transferred to an external environment through the condenser, and the working substance is converted into liquid state
Implementation Method 4
conversion cycles between liquid state and gaseous state by retracting and releasing heat
Implementation Method 5
gravity heat pipe to accommodate working substance that realizes conversion cycles between liquid state and gaseous state
Data Source
AI summary
The present disclosure provides a server heat dissipation system based on gravity heat pipe for dissipating heat from chip of a server, comprising: an evaporator arranged in a chassis of the server and being in thermal contact with the chip, said evaporator having a first cavity internally; a condenser arranged above the server, said condenser having a second cavity internally; and an heat-insulated pipe section passing through the chassis and connecting the evaporator and the condenser, and communicating the first cavity and the second cavity, wherein the evaporator, the condenser and the insulated pipe section are made to form a gravity heat pipe to accommodate working substance that realizes conversion cycles between liquid state and gaseous state by retracting and releasing heat; wherein the heat generated by the chip is transferred to the working substance in liquid state in the first cavity through the evaporator, the working substance absorbs heat and is converted into gaseous state, rising to the second cavity of the condenser through the heat-insulated pipe section, the heat of the working substance is transferred to an external environment through the condenser, and the working substance is converted into liquid state and descends to the first cavity through the heat-insulated pipe section. The present disclosure effectively solves a heat dissipation problem of the chip, while enabling to reduce the power consumption index of an environment where the server is located because the gravity heat pipe does not rely on electricity to operate.