Gravity Dispensing Apparatus for Solder Column Alignment
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Solution Overview
Problem
Current methods for aligning and dispensing electrical interconnect members, such as solder columns, on column grid array (CGA) substrates are time-consuming, prone to errors, and require the use of vacuum, vibration, or adhesive tacky tape, which are inefficient and costly.
Innovation Solution
A refillable apparatus that uses gravity to align and dispense electrical interconnect members onto LGA, CGA, or CCGA substrates, eliminating the need for vacuum, vibration, or adhesive tacky tape, and allowing for various shapes and sizes of interconnect members to be easily handled.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional methods using vacuum, vibration, or adhesive tacky tape are used to align and dispense solder columns, then the solder columns can be placed on the substrate, but the process becomes time-consuming and costly
Solution Approach 1:
The apparatus uses gravity as the natural force to automatically dispense solder columns from the inverted carrier board onto the substrate. The solder columns self-align through gravity's pull, eliminating the need for external vacuum, vibration, or adhesive systems. This self-service mechanism dramatically speeds up the dispensing process while reducing equipment complexity and cost.
2Manufacturing precision
If precise alignment of solder columns is achieved using traditional equipment, then placement accuracy is maintained, but device complexity and cost increase
Solution Approach 1:
The carrier board is pre-configured with precisely positioned holes that match the substrate pad layout before the dispensing process begins. This preliminary arrangement of the carrier board and solder columns ensures that when gravity dispenses the columns, they automatically align with the correct locations on the substrate, maintaining high placement accuracy without complex alignment equipment.
3Ease of operation
If adhesive tacky tape is used to hold solder columns, then the columns can be positioned, but errors and inefficiencies increase
Solution Approach 1:
The invention extracts and removes the adhesive tacky tape from the system entirely. Instead of using adhesive to hold and position solder columns, the apparatus relies on gravity and the pre-configured carrier board geometry to achieve accurate placement. This elimination of adhesive materials reduces placement errors and simplifies the overall operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly speeds up the dispensing process, reduces errors, and provides a low-cost, efficient method for aligning and depositing interconnect members onto substrates, improving the overall efficiency and accuracy of the assembly process.
Implementation Method 1
the plurality of interconnect members drop under the force of gravity from the alignment carrier plate when inverted upside down
Data Source
AI summary
A disposable apparatus with a plurality of preloaded pins such as solder columns, micro-coil springs, or other cylindrically shaped metallic parts (solder columns, et al.) in an array pattern is provided for aligning and dispensing onto a column grid array (CGA) substrate. The apparatus includes a carrier plate with a pattern of holes that is covered by removable covers to retain, position and hold an array of solder columns, et al. Alignment features on the top of the carrier plate plugs into a jig-alignment fixture or frame that precisely positions the solder columns, et al. over a CGA substrate. After inverting (flipping over) the apparatus and jig-fixture or frame upside down, the payload of solder columns, et al. detaches and transfers by gravity onto a pattern of metal pads on the CGA substrate, without the use of vacuum or vibration.