Non-Contact Transfer of Light-Emitting Elements by Gravity
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Solution Overview
Problem
Conventional methods for transferring light-emitting elements onto a package substrate face challenges due to uneven bonding strengths caused by varying heights and alignment difficulties with reduced dimensions, necessitating a more precise and contact-free approach.
Innovation Solution
A non-contact method involving a light-emitting unit with removably connected elements on a supporting substrate, where the elements are disposed above the package substrate and allowed to fall by gravity, utilizing reduced adhesive strength or magnetic disconnection to connect with the substrate, eliminating the need for pressing and ensuring uniform bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a pressing action is used to transfer light-emitting elements onto the substrate, then the elements can be bonded to the substrate, but uneven bonding strengths occur due to different heights of the elements
Solution Approach 1:
The patent replaces the conventional mechanical pressing action with a non-contact transfer mechanism. The light-emitting elements are transferred onto the substrate without applying external pressure, thereby eliminating the problem of uneven bonding strength caused by height variations. The transfer is achieved through a different mechanism that does not rely on mechanical force distribution.
2Manufacturing precision
If the dimensions of light-emitting elements are reduced, then the display resolution is improved, but precise alignment between elements and solder pads becomes more difficult
Solution Approach 1:
The patent introduces a transfer substrate as an intermediary carrier. The light-emitting elements are first formed on the transfer substrate with precise positioning, then transferred to the final substrate. This intermediary approach allows for precise alignment to be achieved during the transfer process, overcoming the difficulty of aligning very small elements directly onto the substrate.
3Adaptability or versatility
If a multiple-transfer method is used to transfer different light-emitting diodes, then various colors can be achieved, but the process complexity increases
Solution Approach 1:
The patent combines multiple light-emitting elements (different colors) onto a single transfer substrate simultaneously. This allows all the elements to be transferred in one operation rather than requiring multiple separate transfer steps, thereby reducing process complexity while maintaining the ability to produce various colors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures consistent bonding pressures and precise alignment without contact, addressing the issues of varying heights and alignment, and facilitating the transfer of light-emitting elements onto the package substrate with improved reliability and precision.
Implementation Method 1
disconnecting the light-emitting elements from the supporting substrate to allow the light-emitting elements to fall onto the package substrate by gravity, so as to connect the surface of each of the light-emitting elements with the package substrate due to the bonding pressure caused by the weight of light-emitting elements
Data Source
AI summary
A method for transferring light-emitting elements onto a package substrate includes: providing a light-emitting unit including a supporting substrate and a plurality of light-emitting elements, each of the light-emitting elements being removably connected to the supporting substrate and having a surface opposite to the supporting substrate; disposing the light-emitting unit spacingly above a package substrate in such a manner that the surface of each of the light-emitting elements faces the package substrate; and disconnecting the light-emitting elements from the supporting substrate to allow the light-emitting elements to fall onto the package substrate by gravity, so as to connect the light-emitting elements with the package substrate in a non-contact transferring method.