Grid-Shaped Adhesive Lamination for Air Pocket Elimination
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Solution Overview
Problem
Existing laminating processes face challenges in avoiding air pockets and defects when using hot melt adhesives, especially with components that have limited air permeability, such as those produced by injection molding or fiber composite materials, due to the complexity and cost of applying laminating grains and the risk of incomplete cross-linking with reactive adhesives.
Innovation Solution
A method involving the application of a hot melt adhesive in a grid pattern between the laminating film and component, forming channels that allow for uniform air removal via negative pressure, reducing the need for complex engravings and vacuum holes, and ensuring sufficient contact with air for moisture-reactive adhesives to prevent incomplete cross-linking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If a laminating grain is applied to the component to enable air removal, then air transport capability is improved, but device complexity and material usage increase
Solution Approach 1:
The adhesive is applied in a segmented grid pattern rather than continuously, creating discrete adhesive areas separated by channels. This segmentation allows air to be removed through the channels while maintaining bonding at the adhesive locations, eliminating the need for complex laminating grains.
Solution Approach 2:
The solution moves from modifying the component surface (adding laminating grain in the vertical dimension) to modifying the adhesive application pattern (creating channels in the planar dimension). This dimensional shift simplifies the overall system by using the adhesive layer itself to create air removal pathways.
2Object-generated harmful factors
If a laminating grain with depth of 0.2 to 0.3 mm is applied, then air removal capability is improved, but component weight increases
Solution Approach 1:
The adhesive is applied in a segmented grid pattern rather than continuously, creating discrete adhesive areas separated by channels. This segmentation allows air to be removed through the channels while maintaining bonding at the adhesive locations, eliminating the need for complex laminating grains.
Solution Approach 2:
The adhesive grid pattern serves as a temporary air removal pathway during the lamination process. Once lamination is complete, the adhesive solidifies and the channels are no longer needed for air removal, having served their purpose during the critical bonding phase.
3Strength
If adhesive is applied as a pre-coating to the film, then bonding is improved, but air pocket formation increases
Solution Approach 1:
The adhesive is applied in a segmented grid pattern rather than continuously, creating discrete adhesive areas separated by channels. This segmentation allows air to be removed through the channels while maintaining bonding at the adhesive locations, eliminating the need for complex laminating grains.
Solution Approach 2:
Different regions of the film surface have different properties: adhesive areas provide bonding functionality while channel areas provide air removal functionality. This local differentiation allows each region to perform its specific function optimally without interfering with the other.
4Object-generated harmful factors
If vacuum holes are introduced to the component, then air removal is improved, but manufacturing complexity increases
Solution Approach 1:
The adhesive application and air removal channel creation are merged into a single step. The grid pattern of the adhesive application automatically creates the channels, eliminating the need for separate vacuum hole introduction and laminating grain application steps.
Solution Approach 2:
The adhesive layer serves multiple functions: it provides bonding strength at the adhesive locations and simultaneously creates air removal channels through its grid pattern. This multi-functionality eliminates the need for separate air removal mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively eliminates air inclusions and defects, reduces material usage and weight, simplifies the lamination process, and allows for the use of materials difficult to engrave, while maintaining a smooth surface appearance and ensuring complete bonding.
Implementation Method 1
by drawing off the air between the component and the film via the channels by applying a negative pressure
Implementation Method 2
The adhesive is a hot melt adhesive which has a Brookfield viscosity of 50 to 1,000,000 mPa s at a processing temperature of 90 °C to 200 °C
Data Source
Figure 1~2
AI summary
The invention relates to a method for laminating components with films, wherein an adhesive is applied in a grid pattern to the surface of the laminating film and/or the component such that, after the film and the component are joined, the adhesive is arranged between the film and the component, and the areas between the adhesive applications form a channel system that allows the removal of air trapped between the component and the film. The invention further relates to a laminated molded part obtainable by the aforementioned method. The use of an adhesive grid arranged between a component and a laminating film leads to a reduction or elimination of air inclusions during the lamination of the component with the laminating film.