Grid-Array Connector Layout for Dense SSD Signal Routing
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Solution Overview
Problem
The increasing demand for higher signal exchange between host devices and SSDs necessitates smaller and closer-packed pins in connectors, leading to increased damage risk and solder bridge formation.
Innovation Solution
A connector design featuring a grid of connection points, such as a ball grid array, on the termination side, with traces connecting contacts to any location in the grid, allowing for flexible signal routing and protection within a housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If pins are made smaller and placed closer together to increase signal exchange capacity, then the connector can handle more signals, but the pins become more easily damaged and solder bridges may form between adjacent pins
Solution Approach 1:
The patent transitions from a linear pin arrangement to a two-dimensional grid array configuration. Connection points are arranged in multiple rows and columns on the termination side, allowing signals to be routed in two dimensions rather than along a single line. This dimensional change enables increased signal capacity without requiring pins to be placed closer together linearly, thereby maintaining pin spacing and reducing damage risk and solder bridge formation.
Solution Approach 2:
The connector is divided into distinct functional zones: a mating side with contacts, an intermediate routing region with traces, and a termination side with a grid of connection points. This segmentation allows the signal path to be distributed across multiple locations and orientations, enabling high signal capacity while maintaining adequate spacing between individual connection points to prevent solder bridges and damage.
2Productivity
If pin density is increased to handle more signals, then signal exchange capacity improves, but manufacturing complexity and risk of solder bridges increase
Solution Approach 1:
By arranging connection points in a two-dimensional grid rather than a linear sequence, the patent achieves high signal capacity without requiring extremely high linear density. The grid layout provides natural spacing between connection points in both horizontal and vertical directions, making the manufacturing process more manageable and reducing the risk of solder bridges while maintaining high productivity in terms of signal exchange capacity.
Data Source
AI summary
A connector for communicatively coupling an electronic device to a host device is provided. The connector includes a mating side and a termination side for surface mounting the connector to the electronic device. The mating side includes a first contact and a second contact. The termination side includes a printed circuit board and a grid of connection points provided on a bottom surface of the printed circuit board. The first contact is communicatively coupled to a first connection point in the grid of connection points and the second contact is communicatively coupled to a second connection point in the grid of connection points.