Grid Array Connector Layout for Resonance and Crosstalk Mitigation
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Solution Overview
Problem
The reduction in socket and connector height to avoid resonance within signaling frequencies in semiconductor chips poses mechanical and manufacturing challenges, particularly in maintaining reliable electrical connections and reducing crosstalk degradation.
Innovation Solution
Implementing a grid array electrical connector with a housing made of lossy dielectric materials and incorporating series resistances in ground traces to mitigate resonance and crosstalk, using lossy conductive materials for ground connections and differential pairs for signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the socket and connector height is reduced to avoid resonance within signaling frequencies, then resonance and crosstalk degradation are reduced, but mechanical reliability and manufacturing difficulty worsen due to inability to maintain sufficient compression forces
Solution Approach 1:
The electrical connection system is divided into two functional segments: compression contacts for mechanical connection and non-compression contacts for electrical connection. This segmentation allows the compression contacts to provide necessary mechanical force while the non-compression contacts maintain consistent electrical connection without contributing to resonance, thus resolving the contradiction between height reduction and mechanical reliability.
Solution Approach 2:
A dielectric member is introduced as an intermediary element between the compression contacts and non-compression contacts. This dielectric member electrically isolates the compression contacts from the non-compression contacts, allowing the compression contacts to maintain mechanical pressure without creating resonant electrical pathways, thereby enabling height reduction while maintaining both mechanical reliability and electrical performance.
2Object-affected harmful factors
If the socket and connector height is reduced to avoid resonance, then signal integrity improves, but manufacturing precision requirements increase due to tighter tolerances needed for reliable connections
Solution Approach 1:
By separating compression and non-compression contact functions into distinct elements, the design allows each type of contact to be optimized independently for its specific function, reducing the need for tight overall tolerances and simplifying manufacturing while maintaining signal integrity.
Solution Approach 2:
The dielectric member acts as a precision-maintaining intermediary that ensures consistent electrical spacing and isolation without requiring the entire connector assembly to meet tight tolerance specifications, thereby reducing manufacturing precision requirements while preventing resonance.
3Reliability
If compression forces are increased to maintain reliable mechanical connections in reduced-height connectors, then mechanical reliability improves, but resonance and crosstalk increase due to stronger electrical coupling
Solution Approach 1:
The contact system is segmented into compression contacts that provide mechanical reliability and non-compression contacts that transmit signals without mechanical pressure. This segmentation eliminates the trade-off by allowing compression forces to be applied only where needed for mechanical stability, without creating harmful electrical coupling that causes crosstalk.
Solution Approach 2:
The dielectric member serves as an electrical intermediary that prevents direct electrical coupling between compression contacts and signal contacts. This allows compression forces to be maintained for mechanical reliability while the dielectric barrier prevents the transmission of mechanical vibrations and electrical noise that would cause crosstalk.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces resonance and crosstalk, maintaining signal integrity and performance by effectively managing electrical connections in high-frequency applications.
Implementation Method 1
housing made of lossy dielectric materials
Implementation Method 2
incorporating series resistances in ground traces to mitigate resonance and crosstalk
Data Source
AI summary
Electrical connectors for a semiconductor device package to a circuit board are provided. The electrical connectors can include interconnections having a first resistance that is greater than a second resistance. Assemblies are provided that include an electrical connector and a circuit board. Assemblies can also include a semiconductor device package. The assemblies provide connections to ground on the circuit board that have a higher resistance than connections for signal input output.


