High-Speed Grid Array Module Shielding for EMI and Heat
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Solution Overview
Problem
Existing computer systems face challenges in providing high memory density and speed while managing mechanical, electrical, and thermal issues associated with high-speed interconnections, particularly due to electromagnetic interference (EMI) and thermal management in modules like DIMMs and SODIMMs.
Innovation Solution
The implementation of an interposer board with compression-based connectors, a shield made of a metal alloy for mechanical and thermal support, and additional ground pins to reduce EMI, along with gaskets for electrical connectivity, enhances the performance of memory modules by improving mechanical integrity, thermal conductivity, and reducing signaling noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high speed interconnections are implemented to increase memory density and speed, then memory performance is improved, but electromagnetic interference (EMI) increases
Solution Approach 1:
An interposer board is introduced as an intermediary component between the memory module and system board. The interposer includes additional ground pins that act as mediators to reduce electromagnetic interference while maintaining high-speed data transmission. The ground pins provide shielding and reference planes that mitigate EMI without sacrificing memory performance.
Solution Approach 2:
The shield is constructed from a metal alloy composite material that combines copper for electrical conductivity with steel for structural integrity and heat transfer. This composite structure provides electromagnetic shielding against EMI while maintaining mechanical strength and thermal management capabilities, allowing high-speed interconnections to operate without excessive interference.
2Productivity
If high bandwidth access is provided to devices with high memory density, then data throughput is improved, but thermal issues increase
Solution Approach 1:
The shield utilizes a metal alloy composite combining copper and steel. The copper provides excellent thermal conductivity to dissipate heat generated by high-bandwidth memory operations, while the steel provides structural support. This composite material enables effective thermal management alongside high data throughput performance.
3Reliability
If compression-based connectors are used to improve mechanical integrity, then connection reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The connector system is segmented into modular components: the interposer board with compression-based pins, the shield with mounting holes, and the PCB with contact layouts. This segmentation allows each component to be manufactured and tested independently, then assembled together. The compression-based connectors provide reliable mechanical and electrical connections while the modular design facilitates manufacturing through standardized processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in improved module performance with increased memory density and speed, reduced EMI, and better thermal management, enabling higher sustained throughput and power savings.
Implementation Method 1
The module board can further be covered by a shield that has a metal alloy having an element to provide good electrical conductivity and an element to provide structural integrity and heat transfer
Implementation Method 2
a removable shield to secure the PCB and the interposer board to the system board, the removable shield to compress the compression-based pins of the pin layout of the interposer board
Data Source
AI summary
A system board includes a module board that connects to the system board with an interposer having compressible connectors. The module board can further be covered by a shield that has a metal alloy having an element to provide good electrical conductivity and an element to provide structural integrity and heat transfer. The module board can further include gaskets to interconnect the shield to a ground plane of the module board. the interposer board can further include an extra column of ground connections to reduce signaling noise between the interposer board and the system board.