Grid Array Package Conductive Pad Pitch Segmentation
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Solution Overview
Problem
The challenge in semiconductor packaging is to provide a denser arrangement of contacts between grid array packages and circuit boards within the same dimension, as the available surface area shrinks and the complexity of conductive pad and trace routing increases, while maintaining high reliability and performance.
Innovation Solution
The solution involves dividing conductive pads on both the package and circuit board into two groups with different pitches, where the first group in the peripheral region is arranged in a larger pitch to allow conductive traces to pass through, and the second group in the inner region is arranged in a smaller pitch to accommodate through holes, optimizing the pitch dimensions based on the conductive trace and through hole dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conductive pads are arranged in a uniform pitch across the entire package surface, then the arrangement is simple and easy to manufacture, but the contact density is low and cannot meet the requirement for higher integration
Solution Approach 1:
The package surface is divided into multiple regions with different pitch values. The conductive pads are segmented into groups based on their regional location, with each group having a specific pitch value. This segmentation allows different regions to have optimized pitch values for their specific functions, thereby increasing overall contact density without excessive complexity.
Solution Approach 2:
Different regions of the package surface are assigned different pitch characteristics. Regions requiring higher contact density use smaller pitch values, while regions requiring trace routing use larger pitch values. This local quality approach optimizes each region's pitch independently based on its specific requirements.
2Quantity of substance
If the pitch between conductive pads is reduced to increase contact density, then more contacts can be accommodated in the same area, but conductive traces cannot pass through adequately and routing becomes difficult
Solution Approach 1:
The package surface is segmented into pad-dense regions and trace-routing regions. Pad-dense regions use smaller pitch values to maximize contact density, while trace-routing regions use larger pitch values to accommodate conductive trace routing. This segmentation resolves the conflict between contact density and trace routing by providing dedicated spaces for each function.
Solution Approach 2:
The pitch value is changed from a uniform single-dimensional parameter to a multi-dimensional parameter that varies across different spatial regions of the package. This allows the pitch to be optimized locally in different areas, enabling both high contact density in certain regions and adequate trace routing space in other regions.
3Ease of operation
If conductive pads are arranged with larger pitch to allow trace routing, then trace routing is easier, but the number of contacts that can be provided is reduced
Solution Approach 1:
The package surface is divided into regions where trace routing is prioritized (with larger pitch) and regions where contact density is prioritized (with smaller pitch). This segmentation ensures that trace routing requirements are met in specific areas while maximizing the number of contacts in other areas, thereby resolving the trade-off between routing ease and contact quantity.
Solution Approach 2:
Different local regions of the package are assigned different pitch qualities based on their functional requirements. Regions requiring trace routing have larger pitch values for ease of routing, while regions requiring high contact density have smaller pitch values. This local optimization allows both trace routing and contact density requirements to be satisfied simultaneously.
Data Source
AI summary
The present invention discloses a dense arrangement in the conductors of a package and the corresponding conductive pads of a circuit board. The conductors and the corresponding conductive pads are separated into at least a first group in a peripheral region of the grid array package, and a second group in another region of the grid array package. Most in the first group of conductive pads are apart at a first pitch, most in the second group of conductive pads are apart at a second pitch which is less than the first pitch. According to the shrinking in the conductive trace on a conductive layer and the shrinking in the through hole, the first pitch and the second pitch are optimized for the maximum conductors and the corresponding conductive pads.