Grid-Structured Encapsulation Film for Photovoltaic PID Resistance
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Solution Overview
Problem
Conventional anti-PID encapsulation adhesive films fail to effectively address charge enrichment on the surfaces of double-sided PERC cell modules, leading to passivation deactivation and power degradation, and are inadequate for reducing the weight of photovoltaic modules while maintaining performance.
Innovation Solution
An anti-PID encapsulation adhesive film with a grid structured insulating layer and a conductive layer, where the conductive layer has a volume resistivity less than 100 Ω·cm, is integrated into the photovoltaic module, allowing for effective ion and charge management by delivering enriched charges away from the cell surfaces, and reducing the need for interconnection bars and bus bars, thereby minimizing module weight.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional anti-PID encapsulation adhesive films are used, then the basic encapsulation function is provided, but they fail to effectively address charge enrichment on cell surfaces leading to PID failure
Solution Approach 1:
The encapsulation adhesive film is segmented into multiple functional layers: a base adhesive film layer and a grid-structured insulating layer. This segmentation allows different regions of the film to perform different functions - the base layer provides encapsulation while the grid layer with its hollow portions strategically positioned over cell surfaces prevents charge enrichment, thereby resolving the PID resistance issue without compromising encapsulation effectiveness.
Solution Approach 2:
The grid-structured insulating layer acts as an intermediary between the base adhesive film and the cell surfaces. By positioning the hollow portions directly over the cell surfaces, this intermediary layer prevents direct contact between charges on the cell surface and the adhesive film, thereby blocking the harmful charge enrichment process that leads to PID failure while still maintaining overall encapsulation integrity.
2Reliability
If the density of encapsulation adhesive film is enhanced to block sodium ion migration, then PID resistance is improved, but the film cannot effectively trap ions and charges that remain on cell surfaces or pass through the film
Solution Approach 1:
The hollow portions of the grid-structured insulating layer are pre-positioned to cover the cell surfaces before any charge migration or enrichment occurs. This preliminary structural arrangement creates preventive zones that block charge enrichment at its source, rather than attempting to trap charges after they have migrated or accumulated, thereby addressing the limitation of conventional dense films that cannot effectively trap surface charges.
3Ease of operation
If traditional photovoltaic module components including interconnection bars and bus bars are used, then electrical connection is achieved, but module weight increases affecting production and transportation
Solution Approach 1:
The grid-structured insulating layer is merged with the base adhesive film to form an integrated encapsulation structure. This merging eliminates the need for separate interconnection bars and bus bars, as the integrated film structure provides both encapsulation and electrical management functions. The result is a significant weight reduction while maintaining all necessary electrical connection capabilities through the film's conductive pathways.
Solution Approach 2:
The encapsulation adhesive film is designed to perform multiple functions simultaneously: it provides encapsulation protection, manages charge distribution through its grid structure, and enables electrical connections without requiring separate components. This multi-functionality eliminates the need for additional weight-bearing components like interconnection bars and bus bars, thereby reducing overall module weight while maintaining electrical connectivity.
4Ease of operation
If welding processes are used for assembling photovoltaic module components, then electrical connections are established, but production costs and labor requirements increase
Solution Approach 1:
The patent replaces the mechanical welding process with a lamination-based assembly method. The grid-structured insulating layer and base adhesive film are bonded to cell surfaces through lamination processes that do not require welding equipment, skilled welders, or post-welding inspections. This substitution dramatically simplifies the manufacturing process, reduces labor requirements, and lowers production costs while maintaining reliable electrical connections through the film's integrated structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively improves PID resistance without affecting photovoltaic module performance, reduces module weight, and eliminates the need for welding processes, lowering production costs and labor, while providing enhanced corrosion protection.
Implementation Method 1
The conductive layer has a volume resistivity less than 100 Ω·cm, allowing for effective ion and charge management by delivering enriched charges away from the cell surfaces
Data Source
AI summary
The present disclosure provides an anti-PID encapsulation adhesive film, a photovoltaic module, and a photovoltaic module manufacturing method. The anti-PID encapsulation adhesive film includes a base adhesive film layer, an insulating layer, and a conductive layer. The insulating layer is located on one side surface of the base adhesive film layer. The insulating layer has a grid structure. The grid structure includes grid lines and a plurality of hollow portions defined by the grid lines. The grid lines have a structure corresponding to gaps between cell pieces. The conductive layer includes a plurality of conductive portions. The conductive portions are arranged in the hollow portions in one-to-one correspondence. The volume resistivity of the conductive portions is less than 100 Ω·cm.