Grid Insulative Regions for Conductive Layers

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Solution Overview

Problem

Existing methods for forming large electrically insulative regions in active layers of conductive or semiconductive materials are inefficient, as they either require extensive material removal or increased embossing force, which can lead to processing difficulties and inadequate electrical isolation.

Innovation Solution

A method involving the formation of an insulative perimeter around a region, followed by further insulative features inside the perimeter to divide the area into isolated parts, using techniques like embossing or etching to create a grid-like structure that enhances electrical isolation without displacing large areas of active material.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If all active material is removed from a large area to form an insulative region, then electrical isolation is achieved, but processing time increases significantly

Engineering Contradiction:
Improveelectrical isolationVSAvoidprocessing time
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent divides a large insulative region into multiple smaller insulative features arranged in a grid pattern. Instead of removing all material from one large area, the invention creates an array of smaller features that collectively provide the required electrical isolation, significantly reducing the total material removal volume and processing time while maintaining adequate isolation performance.

Inventive Principle:
Principle #1Segmentation

2Reliability

If embossing force is increased to displace large areas of active material, then insulative features are formed, but stamp bending or failure and material fracture occur

Engineering Contradiction:
Improveelectrical isolationVSAvoidprocessing difficulty
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent segments the large insulative region into multiple smaller features, which reduces the area each embossing feature must displace. This segmentation allows adequate electrical isolation to be achieved with lower embossing forces, preventing stamp bending, failure, and material fracture that would occur with high-force displacement of large material areas.

Inventive Principle:
Principle #1Segmentation

3Productivity

If narrow insulative lines are formed by etching, then processing is quick and efficient, but electrical isolation barrier is insufficient

Engineering Contradiction:
Improveprocessing speedVSAvoidelectrical isolation
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent merges multiple narrow insulative features into a collective grid structure. While each individual feature remains narrow and quick to form, the combined effect of the grid pattern creates a more robust electrical isolation barrier that is superior to any single narrow line, thus achieving both processing efficiency and adequate isolation performance.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentEP2319104B1Forming electrically insulative regions
Publication Date: 2015.06.24 PRAGMATIC PRINTING LTD
  • EP2319104B1 patent drawingFigure 1a~5
  • EP2319104B1 patent drawingFigure 6~12
  • EP2319104B1 patent drawingFigure 13~16

AI summary

A method of forming an electrically insulative region from an area of a layer of electrically conductive or semi conductive material, such that electrical current flow within the layer and across said area is at least inhibited. The method comprises: forming at least one electrically insulative feature in said layer to define an insulative perimeter around said area, the or each insulative feature being arranged to at least inhibit electrical current flow within the layer of material; and forming at least one further electrically insulative feature inside said perimeter so as to divide said area into a plurality of parts, said parts being at least partially electrically insulated from each another. Devices incorporating such insulative regions are disclosed, as are different methods for forming the insulative features.